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NL17SG34P5T5G

P1-P3P4-P6P7-P9P10-P10
NL17SG34
http://onsemi.com
7
PACKAGE DIMENSIONS
UDFN6 1.0x1.0, 0.35P
CASE 517BX
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.12 0.22
D 1.00 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
A B
E
D
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
2X
2X
A3
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L5X
NOTE 3
L1
1
3
46
M
M
DIMENSIONS: MILLIMETERS
0.22
5X
0.48
6X
1.18
0.53
PITCH
0.35
1
PKG
OUTLINE
NL17SG34
http://onsemi.com
8
PACKAGE DIMENSIONS
UDFN6 1.45x1.0, 0.5P
CASE 517AQ
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
L6X
NOTE 3
0.10 C
PIN ONE
REFERENCE
TOP VIEW
0.10
C
6X
A
A1
0.05 C
0.05 C
C
SEATING
PLANE
SIDE VIEW
1
3
46
DIM MIN MAX
MILLIMETERS
A 0.45 0.55
A1 0.00 0.05
b 0.20 0.30
D 1.45 BSC
E 1.00 BSC
e 0.50 BSC
L 0.30 0.40
L1 −−− 0.15
DIMENSIONS: MILLIMETERS
0.30
6X
1.24
0.53
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.50
1
MOUNTING FOOTPRINT
PACKAGE
OUTLINE
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
A2 0.07 REF
6X
A2
DETAIL B
DETAIL A
NL17SG34
http://onsemi.com
9
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B 1.15 1.350.045 0.053
C 0.80 1.100.031 0.043
D 0.10 0.300.004 0.012
G 0.65 BSC0.026 BSC
H --- 0.10---0.004
J 0.10 0.250.004 0.010
K 0.10 0.300.004 0.012
N 0.20 REF0.008 REF
S 2.00 2.200.079 0.087
B0.2 (0.008)
MM
12 3
45
A
G
S
D
5 PL
H
C
N
J
K
−B−
SC−88A (SC−70−5 / SOT−353)
CASE 419A−02
ISSUE L
ǒ
mm
inches
Ǔ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P9P10-P10

NL17SG34P5T5G

Mfr. #:
Buy NL17SG34P5T5G
Manufacturer:
ON Semiconductor
Description:
Buffers & Line Drivers SINGLE BUFFER
Lifecycle:
New from this manufacturer.
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