LTC3459ES6#TRMPBF

LTC3459
10
3459fc
TYPICAL APPLICATIONS
Figure 5. Charging a SuperCap from a 3.3V Source
SW
L1
V
IN
1M
V
OUT
5V
C
OUT
2F
1
μF
1μF
LTC3459
SHDN
V
OUT
FB
3.3V
OFF ON
GND
332k
3459 F05
C
OUT
: MAXWELL TECHNOLOGIES ULTRACAP PC5-5, 2F, 5V
L1: 33
μH, 1.7Ω TAIYO YUDEN LB2016
+
controlled, preventing any damaging effects of inrush
current. Proper heat sinking of the package is required in
this application as the die may dissipate 100mW to 200mW
during initial charging. When V
OUT
is greater than ~3.5V,
normal boost mode operation and effi ciency begin, with
the P-channel MOSFET acting as a synchronous switch.
Average input current is a constant 50mA during charg-
ing, where the current delivered to the SuperCap varies
somewhat with duty cycle. Once the SuperCap is charged
to 5V, the LTC3459 begins to regulate and the input cur-
rent is reduced to the amount required to support the load
and/or self discharge of the SuperCap.
PACKAGE DESCRIPTION
2.00 p0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WCCD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 p 0.05
BOTTOM VIEW—EXPOSED PAD
0.56 p 0.05
(2 SIDES)
0.75 p0.05
R = 0.115
TYP
1.37 p0.05
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DC6) DFN 1103
0.25 p 0.05
1.42 p0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61 p0.05
(2 SIDES)
1.15 p0.05
0.675 p0.05
2.50 p0.05
PACKAGE
OUTLINE
0.25 p 0.05
0.50 BSC
0.50 BSC
PIN 1
CHAMFER OF
EXPOSED PAD
DC Package
6-Lead Plastic DFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1703)
LTC3459
11
3459fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DCB Package
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
S6 Package
6-Lead Plastic TSOT-23
(Reference LTC DWG # 05-08-1636)
3.00 ±0.10
(2 SIDES)
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 ±0.10
(2 SIDES)
1
3
64
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DCB6) DFN 0405
0.25 ± 0.05
0.50 BSC
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
0.25 ± 0.05
1.35 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD
PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)
2.15 ±0.05
0.70 ±0.05
3.55 ±0.05
PACKAGE
OUTLINE
0.50 BSC
1.50 – 1.75
(NOTE 4)
2.80 BSC
0.30 – 0.45
6 PLCS (NOTE 3)
DATUM ‘A’
0.09 – 0.20
(NOTE 3)
S6 TSOT-23 0302 REV B
2.90 BSC
(NOTE 4)
0.95 BSC
1.90 BSC
0.80 – 0.90
1.00 MAX
0.01 – 0.10
0.20 BSC
0.30 – 0.50 REF
PIN ONE ID
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
3.85 MAX
0.62
MAX
0.95
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.4 MIN
2.62 REF
1.22 REF
LTC3459
12
3459fc
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
FAX: (408) 434-0507
www.linear.com
© LINEAR TECHNOLOGY CORPORATION 2007
LT 1208 REV C • PRINTED IN USA
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SW
, 3MHz, Synchronous Step-Up DC/DC Converter V
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3.3V from a 2 AA Alkaline Input
SW
L1
15
μH
V
IN
R1
604k
V
OUT
3.3V
C3
4.7
μF
C2
47pF
C1
2.2
μF
LTC3459
SHDN
V
OUT
FB
2 AA
CELLS
V
IN
1.8V TO 3V
OFF ON
GND
R2
365k
3459 TA06a
+
+
C1: TDK C1608X5R1A225MT
C2: TDK C0603COG1E470J
C3: TDK C2012X5ROJ475K
L1: COILCRAFT DO3314-153MXB
R1: PANASONIC ERJ3EKF6043V
R2: PANASONIC ERJ3EKF3653V
I
LOAD
(mA)
60
EFFICIENCY (%)
70
80
90
100
0.01 1 10 100
3459 TA06b
50
0.1
V
OUT
= 3.3V
V
IN
= 1.8V
V
IN
= 3V

LTC3459ES6#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 75mA Sync Boost Converter w/out Disconnect
Lifecycle:
New from this manufacturer.
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