COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72281/72291
CMOS SuperSync FIFO™ 65,536 x 9 and 131,072 x 9
16
Figure 6. Partial Reset Timing
t
RS
PRS
t
RSR
REN
t
RSS
4675 drw 09
t
RSR
WEN
t
RSS
RT
SEN
t
RSS
t
RSF
t
RSF
OE = HIGH
OE = LOW
PAE
PAF, HF
Q
0
- Q
n
t
RSF
EF/OR
FF/IR
t
RSF
t
RSF
If FWFT = HIGH, OR = HIGH
If FWFT = LOW, EF = LOW
If FWFT = LOW, FF = HIGH
If FWFT = HIGH, IR = LOW
t
RSS
17
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72281/72291
CMOS SuperSync FIFO™ 65,536 x 9 and 131,072 x 9
Figure 8. Read Cycle, Empty Flag and First Data Word Latency Timing (IDT Standard Mode)
NOTES:
1. tSKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that EF will go HIGH (after one RCLK cycle plus tREF). If the time between
the rising edge of WCLK and the rising edge of RCLK is less than tSKEW3, then EF deassertion may be delayed one extra RCLK cycle.
2. LD = HIGH.
NOTES:
1. tSKEW1 is the minimum time between a rising RCLK edge and a rising WCLK edge to guarantee that FF will go high (after one WCLK cycle pus tWFF). If the time between the
rising edge of the RCLK and the rising edge of the WCLK is less than tSKEW1, then the FF deassertion may be delayed one extra WCLK cycle.
2. LD = HIGH, OE = LOW, EF = HIGH.
Figure 7. Write Cycle and Full Flag Timing (IDT Standard Mode)
D
0
- D
n
WEN
RCLK
REN
tENH
tENH
Q
0
- Q
n
DATA READ NEXT DATA READDATA IN OUTPUT REGISTER
tSKEW1
(1)
4675 drw 10
WCLK
NO WRITE
1
2
1
2
tDS
NO WRITE
tWFFtWFF
tWFF
tENS
tENS
tSKEW1
(1)
tDS
D
X
tDH
D
X
+1
tWFF
tDH
tCLK
tCLKLtCLKH
tA
tA
RCLK
REN
4675 drw 11
EF
t
ENH
t
REF
t
A
t
OLZ
t
OE
Q
0
- Q
n
OE
WCLK
(1)
t
SKEW3
WEN
D
0
- D
n
t
ENS
t
ENS
t
ENH
t
DS
t
DHS
D
0
1
2
t
OLZ
LAST WORD
D
0
D
1
D
1
t
ENS
t
ENH
t
DS
t
DH
t
OHZ
LAST WORD
t
ENH
t
ENS
t
A
t
A
t
ENS
t
ENH
t
CLK
t
CLKH
t
CLKL
t
REF
t
REF
NO OPERATION
NO OPERATION
COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72281/72291
CMOS SuperSync FIFO™ 65,536 x 9 and 131,072 x 9
18
Figure 9. Write Timing (First Word Fall Through Mode)
NOTES:
1. t
SKEW3 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that OR will go LOW after two RCLK cycles plus tREF. If the time between the rising edge of WCLK and the rising edge of
RCLK is less than t
SKEW3, then OR assertion may be delayed one extra RCLK cycle.
2. t
SKEW2 is the minimum time between a rising WCLK edge and a rising RCLK edge to guarantee that PAE will go HIGH after one RCLK cycle plus tPAE. If the time between the rising edge of WCLK and the rising edge of
RCLK is less than t
SKEW2, then the PAE deassertion may be delayed one extra RCLK cycle.
3. LD = HIGH, OE = LOW.
4. n = PAE offset, m = PAF offset and D = maximum FIFO depth.
5. D = 65,537 for the IDT72281 and 131,073 for the IDT72291.
W
1
W
2
W
4
W
[n +2]
W
[D-m-1]
W
[D-m-2]
W
[D-1]
W
D
W
[n+3]
W
[n+4]
W
[D-m]
W
[D-m+1]
WCLK
WEN
D
0
- D
8
RCLK
t
DH
t
DS
t
SKEW3
(1)
REN
Q
0
- Q
8
PAF
HF
PAE
IR
t
DS
t
DS
t
DS
t
SKEW2
t
A
t
REF
OR
t
HF
t
PAF
t
WFF
W
[D-m+2]
W
1
t
ENH
4675 drw 12
DATA IN OUTPUT REGISTER
(2)
W
3
1
2
3
1
D-1
][
W
D-1
][
W
D-1
][
W
1
2
t
PAE

72281L15TF8

Mfr. #:
Manufacturer:
Description:
IC FIFO 32768X18 LP 15NS 64QFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union