AD8133 Data Sheet
Rev. A | Page 6 of 17
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
04769-0-101
2
1
3
4
5
6
18
17
16
15
14
13
8
9
10
11
7
12
20
19
21
22
23
24
AD8133
T
O
P VIEW
OPD
V
S–
–IN A
+IN A
V
S–
V
OCM
C
V
S+
–IN C
+IN C
V
S–
–OUT A
NOTES
1. EXPOSED PAD. THE EXPOSED PADDLE MUST BE SOLDERED TO A PAD
ON TOP OF THE BOARD THAT IS CONNECTED TO AN INNER PLANE
WITH SEVERAL THERMAL VIAS.
–OUT C
V
S+
–IN B
+IN B
V
S–
V
OCM
A
V
OCM
B
+OUT A
V
S+
+OUT B
–OUT B
V
S+
+OUT C
Figure 4. 24-Lead LFCSP
Table 5. Pin Function Descriptions
Pin No. Mnemonic Description
1 OPD Output Pull-Down.
2, 5, 14, 21 V
S−
Negative Power Supply Voltage.
3 −IN A Inverting Input, Amplifier A.
4 +IN A Noninverting Input, Amplifier A.
6 −OUT A Negative Output, Amplifier A.
7 +OUT A Positive Output, Amplifier A.
8, 11, 17, 24 V
S+
Positive Power Supply Voltage.
9 +OUT B Positive Output, Amplifier B.
Negative Output, Amplifier B.
12 +OUT C Positive Output, Amplifier C.
13 −OUT C Negative Output, Amplifier C.
15 +IN C Noninverting Input, Amplifier C.
16 −IN C Inverting Input, Amplifier C.
18 V
OCM
C Voltage Applied to This Pin Controls Output Common-Mode Voltage, Amplifier C.
19 V
OCM
B Voltage Applied to This Pin Controls Output Common-Mode Voltage, Amplifier B.
20 V
OCM
A Voltage Applied to This Pin Controls Output Common-Mode Voltage, Amplifier A.
22 +IN B Noninverting Input, Amplifier B.
23 −IN B Inverting Input, Amplifier B.
EPAD Exposed Pad. The exposed paddle must be soldered to a pad on top of the board that is
connected to an inner plane with several thermal vias.