ADG772 Data Sheet
Rev. C | Page 12 of 12
OUTLINE DIMENSIONS
033007-A
0.40
BSC
1
46
9
P
I
N
1
I
D
E
N
T
I
F
I
E
R
TOP VIEW
BOTTOM VIEW
SEATING
PLANE
0.20 DIA
TYP
0.60
0.55
0.50
0.20 BSC
1.60
1.30
0.55
0.40
0.30
0.35
0.30
0.25
0.05 MAX
0.02 NOM
Figure 31. 10-Lead Mini Lead Frame Chip Scale Package [LFCSP]
1.30 mm × 1.60 mm Body and 0.55 mm Package Height
(CP-10-10)
Dimensions shown in millimeters
1.45
1.30 SQ
1.15
111808-A
1
0.50
BSC
BOTTOM VIEWTOP VIEW
12
4
6
7
9
10
3
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
3.10
3.00 SQ
2.90
0.70
0.60
0.50
SEATING
PLANE
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDI
ATOR
0.30
0.23
0.18
COMPLIANT
TO
JEDEC STANDARDS MO-220-WEED.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.80
0.75
0.70
Figure 32. 12-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body and 0.75 mm Package Height
(CP-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding
ADG772BCPZ-1REEL −40°C to +85°C 12-Lead Lead Frame Chip Scale Package [LFCSP] CP-12-4 S2P
ADG772BCPZ-REEL7 −40°C to +85°C 10-Lead Mini Lead Frame Chip Scale Package [LFCSP] CP-10-10 B
EVAL-ADG772EBZ −40°C to +85°C Evaluation Board
1
Z = RoHS Compliant Part.
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D06692-0-5/16(C)
