STP08IE120F4

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STP08IE120F4 Electrical characteristics
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2.2 Test circuits
Figure 12. Inductive load switching and RBSOA test circuit
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Package mechanical data STP08IE120F4
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3 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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STP08IE120F4 Package mechanical data
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DIM.
mm.
MIN. TYP MAX.
A4.30 4.70
A1 2.60 3
A2 1.30 1.50 1.70
b0.50 0.70
b1 1.05
b2 1.3
b3 1.25
b4 1.50
c 0.45 0.50 0.60
D 15.50 15.90
E 9.80 10.20
e 2.29 2.54 2.79
e1 7.62
H1 6.30 6.70
L 13.60
L1 3.30
L2 15.40 15.80
Dia P 3 3.40
Q3.30 3.50
TO220FP-4L MECHANICAL DATA
7514291B

STP08IE120F4

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
IGBT Transistors PWR BIP/S.SIGNAL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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