MIO1200-25E10

© 2011 IXYS All rights reserved
1 - 6
20110119a
MIO 1200-25E10
IXYS reserves the right to change limits, test conditions and dimensions.
I
C80
= 1200 A
V
CES
= 2500 V
V
CE(sat) typ.
= 2.5 V
IGBT Module
Single switch
Short Circuit SOA Capability
Square RBSOA
Symbol Conditions Maximum Ratings
V
CES
V
GE
= 0 V 2500 V
V
GES
±
20 V
I
C80
T
C
= 80°C 1200 A
I
CM
t
p
= 1 ms; T
C
= 80°C 2400 A
t
SC
V
CC
= 1800 V; V
CEM CHIP
=
<
2500 V; 10 µs
V
GE
< 15 V; T
VJ
< 125°C
IGBT
CCC
C'
G
E'
E
E
E
Features
• NPT³ IGBT
- Low-loss
- Smooth switching waveforms for
good EMC
• Industry standard package
- High power density
- AISiC base-plate for high power
cycling capacity
- AIN substrate for low thermal resistance
Typical Applications
• AC power converters for
- industrial drives
- windmills
- traction
LASER pulse generator
Symbol Conditions Characteristic Values
(T
VJ
= 25°C, unless otherwise specified)
min. typ. max.
V
CE(sat)
I
C
= 1200 A; V
GE
= 15 V; T
VJ
= 25°C 2.5 V
T
VJ
= 125°C 3.1 3.4 V
V
GE(th)
I
C
= 240 mA; V
CE
= V
GE
6 7.5 V
I
CES
V
CE
= 2500 V; V
GE
= 0 V; T
VJ
= 125°C 120 mA
I
GES
V
CE
= 0 V; V
GE
=
±
20 V; T
VJ
= 125°C 500 nA
t
d(on)
365 ns
t
r
250 ns
t
d(off)
980 ns
t
f
345 ns
E
on
1150 mJ
E
off
1250 mJ
C
ies
186 nF
C
oes
V
CE
= 25 V; V
GE
= 0 V; f = 1 MHz 13.7 nF
C
res
3.0 nF
Q
ge
I
C
= 1200 A; V
CE
= 1250 V; V
GE
=
±
15 V 12.2 µC
R
thJC
0.009 K/W
Collector emitter saturation voltage is given at chip level
Inductive load; T
VJ
= 125°C; V
GE
=
±
15 V;
V
CC
= 1250V; I
C
= 1200A; R
G
= 1.5Ω; L
σ
= 100nH
p h a s e - o u t
© 2011 IXYS All rights reserved
2 - 6
20110119a
MIO 1200-25E10
Diode
Symbol Conditions Maximum Ratings
I
F80
T
C
= 80°C 1200 A
I
FSM
V
R
= 0 V; T
VJ
= 125°C; t
p
= 10 ms; half-sinewave 11000 A
Symbol Conditions Characteristic Values
min. typ. max.
V
F
I
F
= 1200 A; T
VJ
= 25°C 1.75 V
T
VJ
= 125°C 1.8 V
I
RM
1180 A
t
rr
970 ns
Q
RR
1150 µC
E
rec
990 mJ
R
thJC
0.017 K/W
Forward voltage is given at chip level
Module
Symbol Conditions Maximum Ratings
T
JM
max. junction temperature +150 °C
T
VJ
Operating temperature -40...+125 °C
T
stg
Storage temperature -40...+125 °C
V
ISOL
50 Hz 5000 V~
M
d
Mounting torque Base-heatsink, M6 screws 4 - 6 Nm
Main terminals, M8 screws 8 - 10 Nm
Symbol Conditions Characteristic Values
min. typ. max.
d
A
Clearance distance terminal to base 23 mm
terminal to terminal 19 mm
d
S
Surface creepage terminal to base 33 mm
distance terminal to terminal 33 mm
L
σσ
σσ
σ
Module stray inductance, C to E terminal 10 nH
R
term-chip
*
)
Resistance terminal to chip 0.085 mΩ
R
thCH
per module; λ grease = 1 W/m•K 0.006 K/W
Weight 1500 g
*
)
V = V
CE(sat)
+ R
term-chip
· I
C
resp. V = V
F
+ R
term-chip
· I
F
V
CC
= 1250 V; I
C
= 1200 A;
V
GE
=
±
15 V; R
G
= 1.5 Ω; T
VJ
= 125°C
Inductive load; L
σ
= 100nH
p h a s e - o u t
© 2011 IXYS All rights reserved
3 - 6
20110119a
MIO 1200-25E10
0
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2400
012345
V
CE
[V]
I
C
[A]
V
GE
= 15 V
25 °C
125 °C
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
012345678910111213
V
GE
[V]
I
C
[A]
25 °C
125 °C
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
0123456
V
CE
[V]
I
C
[A]
Tvj = 25°C
17 V
9 V
11 V
15 V
13 V
0
200
400
600
800
1000
1200
1400
1600
1800
2000
2200
2400
0123456
V
CE
[V]
I
C
[A]
T
vj
= 125 °C
15 V
9 V
11 V
13 V
17 V
0
5
10
15
20
024681012
Q
g
[µC]
V
GE
[V]
V
CC
= 1250
V
CC
= 1750
I
C
= 1200 A
T
vj
= 25 °C
1
10
100
1000
0 5 10 15 20 25 30 35
V
CE
[V]
C [nF]
V
GE
= 0 V
f
OSC
= 1 MHz
V
OSC
= 50 mV
C
ies
C
oes
C
res
Fig. 3 Typical onstate characteristics, chip level Fig. 4 Typical transfer characteristics, chip level
Fig. 1 Typical output characteristics, chip level Fig. 2 Typical output characteristics, chip level
Fig. 5 Typical gate charge characteristics Fig. 6 Typical capacitances vs
collector-emitter voltage
p h a s e - o u t

MIO1200-25E10

Mfr. #:
Manufacturer:
Description:
MOD IGBT SGL SWITCH 2500V E10
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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