IRFI4019H-117P

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8/22/06
IRFI4019H-117P
Notes through are on page 2
DIGITAL AUDIO MOSFET
TO-220 Full-Pak 5 PIN
Features
Integrated Half-Bridge Package
Reduces the Part Count by Half
Facilitates Better PCB Layout
Key Parameters Optimized for Class-D
Audio Amplifier Applications
Low R
DS(ON)
for Improved Efficiency
Low Qg and Qsw for Better THD and
Improved Efficiency
Low Qrr for Better THD and Lower EMI
Can Delivery up to 200W per Channel into
8 Load in Half-Bridge Configuration
Amplifier
Lead-Free Package
Description
This Digital Audio MosFET Half-Bridge is specifically designed for Class D audio amplifier applications. It
consists of two power MosFET switches connected in half-bridge configuration. The latest process is used
to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery, and
internal Gate resistance are optimized to improve key Class D audio amplifier performance factors such
as efficiency, THD and EMI. These combine to make this Half-Bridge a highly efficient, robust and reliable
device for Class D audio amplifier applications.
G1, G2 D1, D2 S1, S2
Gate Drain Source
Absolute Maximum Ratings h
Parameter Units
V
DS
Drain-to-Source Voltage V
V
GS
Gate-to-Source Voltage
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V
A
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V
I
DM
Pulsed Drain Current c
E
AS
Single Pulse Avalanche Energyd
mJ
P
D
@T
C
= 25°C
Power Dissipation f
W
P
D
@T
C
= 100°C
Power Dissipation f
Linear Derating Factor W/°C
T
J
Operating Junction and °C
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds
(1.6mm from case)
Mounting torque, 6-32 or M3 screw
Thermal Resistance h
Parameter Typ. Max. Units
R
θJC
Junction-to-Case f
––– 6.9
R
θJA
Junction-to-Ambient f
––– 65
77
18
7.2
0.15
10lbxin (1.1Nxm)
-55 to + 150
300
Max.
6.2
34
±20
150
8.7
S2
G2
S1/D2
G1
D1
V
DS
150 V
R
DS(ON)
typ. @ 10V
80
m:
Q
g
typ.
13 nC
Q
sw
typ.
4.1 nC
R
G(int)
typ.
2.5
T
J
max
150 °C
Key Parameters h
PD - 97074A
IRFI4019H-117P
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S
D
G
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 5.8mH, R
G
= 25, I
AS
= 5.2A.
Pulse width 400µs; duty cycle 2%.
Notes:
R
θ
is measured at T
J
of approximately 90°C.
Limited by Tjmax. See Figs. 14, 15, 17a, 17b for repetitive
avalanche information
Specifications refer to single MosFET.
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified) h
Parameter Min. Typ. Max. Units
BV
DSS
Drain-to-Source Breakdown Voltage 150 ––– ––– V
∆ΒV
DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.19 ––– V/°C
R
DS(on)
Static Drain-to-Source On-Resistance ––– 80 95
m
V
GS(th)
Gate Threshold Voltage 3.0 ––– 4.9 V
V
GS(th)
/T
J
Gate Threshold Voltage Coefficient ––– -11 ––– mV/°C
I
DSS
Drain-to-Source Leakage Current ––– ––– 20 µA
––– ––– 250
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100 nA
Gate-to-Source Reverse Leakage ––– ––– -100
g
fs
Forward Transconductance 11 ––– ––– S
Q
g
Total Gate Charge ––– 13 20
Q
gs1
Pre-Vth Gate-to-Source Charge ––– 3.3 –––
Q
gs2
Post-Vth Gate-to-Source Charge ––– 0.8 ––– nC
Q
gd
Gate-to-Drain Charge ––– 3.9 –––
Q
godr
Gate Charge Overdrive ––– 5.0 ––– See Fig. 6 and 19
Q
sw
Switch Charge (Q
gs2
+ Q
gd
)
––– 4.1 –––
R
G(int)
Internal Gate Resistance ––– 2.5 –––
t
d(on)
Turn-On Delay Time ––– 7.0 –––
t
r
Rise Time ––– 6.6 –––
t
d(off)
Turn-Off Delay Time ––– 13 ––– ns
t
f
Fall Time ––– 3.1 –––
C
iss
Input Capacitance ––– 810 –––
C
oss
Output Capacitance ––– 100 ––– pF
C
rss
Reverse Transfer Capacitance ––– 15 –––
C
oss
Effective Output Capacitance ––– 97 –––
L
D
Internal Drain Inductance ––– 4.5 ––– Between lead,
nH 6mm (0.25in.)
L
S
Internal Source Inductance ––– 7.5 ––– from package
Diode Characteristics h
Parameter Min. Typ. Max. Units
I
S
@ T
C
= 25°C
Continuous Source Current ––– ––– 8.7
(Body Diode) A
I
SM
Pulsed Source Current ––– ––– 34
(Body Diode)c
V
SD
Diode Forward Voltage ––– ––– 1.3 V
t
rr
Reverse Recovery Time ––– 57 86 ns
Q
rr
Reverse Recovery Charge ––– 140 210 nC
I
D
= 5.2A
ƒ = 1.0MHz, See Fig.5
T
J
= 25°C, I
F
= 5.2A
di/dt = 100A/µs e
T
J
= 25°C, I
S
= 5.2A, V
GS
= 0V e
showing the
integral reverse
p-n junction diode.
Conditions
V
GS
= 0V, I
D
= 250µA
Reference to 25°C, I
D
= 1mA
V
GS
= 10V, I
D
= 5.2A e
V
DS
= V
GS
, I
D
= 50µA
V
DS
= 150V, V
GS
= 0V
V
GS
= 0V, V
DS
= 0V to 120V
V
DS
= 150V, V
GS
= 0V, T
J
= 125°C
V
GS
= 20V
V
GS
= -20V
V
GS
= 10V
I
D
= 5.2A
V
GS
= 0V
MOSFET symbol
R
G
= 2.4
V
DS
= 50V, I
D
= 5.2A
Conditions
and center of die contact
V
DD
= 75V, V
GS
= 10Ve
V
DS
= 75V
V
DS
= 25V
IRFI4019H-117P
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Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance vs. Temperature
Fig 6. Typical Gate Charge vs.Gate-to-Source Voltage
Fig 5. Typical Capacitance vs.Drain-to-Source Voltage
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.01
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
60µs PULSE WIDTH
Tj = 25°C
5.5V
VGS
TOP 15V
12V
10V
9.0V
8.0V
7.0V
6.0V
BOTTOM 5.5V
1 10 100 1000
V
DS
, Drain-to-Source Voltage (V)
1
10
100
1000
10000
100000
C
,
C
a
p
a
c
i
t
a
n
c
e
(
p
F
)
Coss
Crss
Ciss
V
GS
= 0V, f = 1 MHZ
C
iss
= C
gs
+ C
gd
, C
ds
SHORTED
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
0 5 10 15 20
Q
G
Total Gate Charge (nC)
0
4
8
12
16
20
V
G
S
,
G
a
t
e
-
t
o
-
S
o
u
r
c
e
V
o
l
t
a
g
e
(
V
)
V
DS
= 120V
VDS= 75V
VDS= 30V
I
D
= 5.2A
0.1 1 10 100
V
DS
, Drain-to-Source Voltage (V)
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
A
)
60µs PULSE WIDTH
Tj = 150°C
5.5V
VGS
TOP 15V
12V
10V
9.0V
8.0V
7.0V
6.0V
BOTTOM 5.5V
-60 -40 -20 0 20 40 60 80 100 120 140 160
T
J
, Junction Temperature (°C)
0.0
0.5
1.0
1.5
2.0
2.5
R
D
S
(
o
n
)
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
O
n
R
e
s
i
s
t
a
n
c
e
(
N
o
r
m
a
l
i
z
e
d
)
I
D
= 5.2A
V
GS
= 10V
4 5 6 7 8
V
GS
, Gate-to-Source Voltage (V)
0.1
1
10
100
I
D
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
C
u
r
r
e
n
t
(
Α
)
V
DS
= 50V
60µs PULSE WIDTH
T
J
= 25°C
T
J
= 175°C

IRFI4019H-117P

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 150V 2 x N-CH 8.7A for Digital Audio
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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