SpecNo.JENF243J-0004B-01 P3/8
MURATA MFG.CO., LTD
Reference Only
2.9±0.2
2.0±0.05
4.0±0.1
Direction of feed
1.7±0.2
※
Lead- in/out wire
4.0±0.1
3.6±0.2
8.0±0.2
1.75±0.13.5±0.05
φ
1.5
-0
+0.1
0.2
※
The packing directions of the chip coil
in taping are unified with the in/out
positions of the lead wire.
( )
No. Item Specification Test Method
7.4 Solderability The wetting area of the electrode shall
be at least 90% covered with new
solder coating.
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 240±5°C
Immersion Time: 3±1 s
7.5 Resistance to
Soldering Heat
Appearance: No damage
Impedance Change: within ± 10%
Flux: Ethanol solution of rosin,25(wt)%
(Immersed for 5s to 10s)
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating: 150±10°C / 60 to 90s
Solder Temperature: 270±5°C
Immersion Time: 10±1 s
Then measured after exposure in the room
condition for 24±2 hours.
8.Environmental Performance (It shall be soldered on the substrate.)
No. Item Specification Test Method
8.1 Heat Resistance Appearance: No damage
Impedance Change: within ± 10%
DC Resistance Change: within ± 10%
Temperature: 105±2°C
Time: 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.2 Cold Resistance Temperature: -40±2°C
Time: 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.3 Humidity Temperature: 40±2°C
Humidity: 90~95%(RH)
Time: 1000 h (+48h , -0h)
Then measured after exposure in the room condition
for 24±2 hours.
8.4 Temperature
Cycle
1 cycle:
1 step: -40±2°C / 30±3 min
2 step: Ordinary temp. / 10 to 15 min
3 step: +105±2°C / 30±3 min
4 step: Ordinary temp. / 10 to 15 min
Total of 10 cycles
Then measured after exposure in the room condition
for 24±2 hours.
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape
(in mm)
Dimension of the Cavity is measured
at the bottom side.
