NFZ32BW150HN10L Datasheet NFZ32BW210HN10L, NFZ32BW320HN10L, NFZ32BW700HN10L | P4-P6

SpecNo.JENF243J-0004B-01 P4/8

MURATA MFG.CO., LTD

Reference Only

9.2 Specification of Taping

(1) Packing quantity (standard quantity)

2,000 pcs / reel

(2) Packing Method

Products shall be packed in the each embossed cavity of plastic tape and sealed by cover tape.

(3) Sprocket hole

The sprocket holes are to the right as the tape is pulled toward the user.

(4) Spliced point

Plastic tape and Cover tape has no spliced point.

(5) Missing components number

Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and

are not continuous. The specified quantity per reel is kept.

9.3 Pull Strength

Embossed carrier tape 10N min.

Cover tape 5N min.

9.4 Peeling off force of cover tape

Speed of Peeling off 300mm/min

Peeling off force

0.2 to 0.7N

(minimum value is typical)

9.5 Dimensions of Leader-tape, Trailer and Reel

There shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.

9.6 Marking for reel

Customer part number, MURATA part number, Inspection number(∗1), RoHS marking(∗2), Quantity etc ･･･

∗1) <Expression of Inspection No.> □□ OOOO ×××

(1) (2) (3)

(1) Factory Code

(2) Date First digit : Year / Last digit of year

Second digit

: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, D

Third, Fourth digit : Day

(3) Serial No.

∗2) « Expression of RoHS marking » ROHS – Y (△)

(1) (2)

(1) RoHS regulation conformity

(2) MURATA classification number

9.7 Marking for Outside package (corrugated paper box)

Customer name, Purchasing order number, Customer part number, MURATA part number,

RoHS marking (∗2) ,Quantity, etc ･･･

165 to 180 degree

Cover tape

Plastic tape

190 min

2.0±0.5

13.0±0.2

21.0±0.8

210 min

60±

13±1.4

180

9±

(in mm)

Trailer

160 min.

Direction of feed

Empty tape

Leader

Cover tape

Label

SpecNo.JENF243J-0004B-01 P5/8

MURATA MFG.CO., LTD

Reference Only

9.8. Specification of Outer Case

Outer Case Dimensions (mm)

Standard Reel Quantity

in Outer Case (Reel)

W D H

186 186 93 5

∗ Above Outer Case size is typical. It depends on a quantity

of an order.

10. Caution

Limitation of Applications

Please contact us before using our products for the applications listed below which require especially high reliability

for the prevention of defects which might directly cause damage to the third party's life, body or property.

(1) Aircraft equipment

(6) Transportation equipment (vehicles, trains, ships, etc.)

(2) Aerospace equipment

(7) Traffic signal equipment

(3) Undersea equipment

(8) Disaster prevention / crime prevention equipment

(4) Power plant control equipment

(9) Data-processing equipment

(5) Medical equipment

(10) Applications of similar complexity and /or reliability

requirements to the applications listed in the above

11. Notice

This product is designed for solder mounting.

Please consult us in advance for applying other mounting method such as conductive adhesive.

11.1 Land pattern designing

Recommended land pattern for flow and reflow soldering is as follows:

It has been designed for Electric characteristics and solderability.

Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or

solderability may be affected, or result to "position shift" in soldering process.

(Reflow) (Flow)

(in mm) (in mm)

(Distance between the products for Flow)

(in mm)

11.2 Flux, Solder

Flux

・Use rosin-based flux.

・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value).

・Don’t use water-soluble flux.

Solder

・Use Sn-3.0Ag-0.5Cu solder

・Standard thickness of solder paste : 100μm to 150μm

Other flux (except above) Please contact us for details, then use.

Label

4.8

2.2

1.3

0.8

2.5

Chip Noise Filter

Land

Solder Resist

Land

Chip Noise Filter

Solder Resist

(in mm)

SpecNo.JENF243J-0004B-01 P6/8

MURATA MFG.CO., LTD

Reference Only

11.3 Flow soldering conditions / Reflow soldering conditions

・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited

to 100°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is

limited to 100°C max.

Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.

・Standard soldering profile and the limit soldering profile is as follows.

The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the

deterioration of product quality.

(1) Flow soldering profile

Standard Profile Limit Profile

Pre-heating 150℃、60s min.

Heating 250℃、4s～6s 265 ±3℃℃、5s

Cycle of flow 2 times 1 time

(2)Reflow soldering profile

Standard Profile Limit Profile

Pre-heating 150～180°C 、90s±30s

Heating above 220°C、30s～60s above 230°C、60s max.

Peak temperature 245±3°C 260°C,10s

Cycle of reflow 2 times 2 times

150

90s±30s

Time(s)

245℃±3℃

Temp.

(℃)

220℃

30s～60s

180

260℃

230℃

60s max

Limit Profile

Standard Profile

265℃±3℃

Heating Time

150

Limit Profile

Standard Profile

(s)Time.

Temp.

(℃)

60s min.

250℃

P1-P3 P4-P6 P7-P8

NFZ32BW150HN10L

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EMI Filter Beads, Chips & Arrays 1210 15ohm 30%

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NFZ32BW150HN10L

NFZ32BW150HN10L

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