OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

74AUP3G0434DCH

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23
74AUP3G0434 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 17 January 2013 12 of 22
NXP Semiconductors
74AUP3G0434
Low-power dual inverter and single buffer
13. Package outline
Fig 10. Package outline SOT765-1 (VSSOP8)
UNIT
A
1
A
max.
A
2
A
3
b
p
LH
E
L
p
wyv
ceD
(1)
E
(2)
Z
(1)
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.00
0.85
0.60
0.27
0.17
0.23
0.08
2.1
1.9
2.4
2.2
0.5
3.2
3.0
0.4
0.1
8°
0°
0.13 0.10.20.4
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.40
0.15
Q
0.21
0.19
SOT765-1 MO-187
02-06-07
w M
b
p
D
Z
e
0.12
14
8
5
θ
A
2
A
1
Q
L
p
(A
3
)
detail X
A
L
H
E
E
c
v M
A
X
A
y
2.5 5 mm0
scale
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
1
pin 1 index
74AUP3G0434 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 17 January 2013 13 of 22
NXP Semiconductors
74AUP3G0434
Low-power dual inverter and single buffer
Fig 11. Package outline SOT833-1 (XSON8)
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT833-1 - - -
MO-252
- - -
SOT833-1
07-11-14
07-12-07
DIMENSIONS (mm are the original dimensions)
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm
D
E
e
1
e
A
1
b
L
L
1
e
1
e
1
0 1 2 mm
scale
Notes
1. Including plating thickness.
2. Can be visible in some manufacturing processes.
UNIT
mm
0.25
0.17
2.0
1.9
0.35
0.27
A
1
max
b E
1.05
0.95
D
ee
1
L
0.40
0.32
L
1
0.50.6
A
(1)
max
0.5 0.04
1
8
2
7
3
6
4
5
8×
(2)
4×
(2)
A
74AUP3G0434 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 17 January 2013 14 of 22
NXP Semiconductors
74AUP3G0434
Low-power dual inverter and single buffer
Fig 12. Package outline SOT1089 (XSON8)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1089
MO-252
sot1089_po
10-04-09
10-04-12
Unit
mm
max
nom
min
0.5 0.04 1.40
1.35
1.30
1.05
1.00
0.95
0.55 0.35
0.35
0.30
0.27
A
(1)
Dimensions
Note
1. Including plating thickness.
2. Visible depending upon used manufacturing technology.
XSON8: extremely thin small outline package; no leads;
8 terminals; body 1.35 x 1 x 0.5 mm
SOT1089
A
1
bL
1
0.40
0.35
0.32
0.20
0.15
0.12
DEee
1
L
0 0.5 1 mm
scale
terminal 1
index area
E
D
detail X
A
A
1
L
L
1
b
e
1
e
terminal 1
index area
1
4
8
5
(4×)
(2)
(8×)
(2)
X
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P23

74AUP3G0434DCH

Mfr. #:
Buy 74AUP3G0434DCH
Manufacturer:
Nexperia
Description:
Inverters 74AUP3G0434DC/VSSOP8/REEL 7" Q
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet