MAX113/MAX117
+3V, 400ksps, 4/8-Channel,
8-Bit ADCs with 1µA Power-Down
_______________________________________________________________________________________ 7
_______________Detailed Description
Converter Operation
The MAX113/MAX117 use a half-flash conversion tech-
nique (see
Functional Diagram
) in which two 4-bit flash
ADC sections achieve an 8-bit result. Using 15 com-
parators, the flash ADC compares the unknown input
voltage to the reference ladder and provides the upper
four data bits. An internal digital-to-analog converter
(DAC) uses the four most significant bits (MSBs) to
generate both the analog result from the first flash con-
version and a residue voltage that is the difference
between the unknown input and the DAC voltage. The
residue is then compared again with the flash com-
parators to obtain the lower four data bits (LSBs).
An internal analog multiplexer enables the devices to
read four (MAX113) or eight (MAX117) different analog
voltages under microprocessor (µP) control. One of the
MAX117’s analog channels, IN8, is internally hard-
wired and always reads V
REF+
when selected.
Power-Down Mode
In burst-mode or low-sample-rate applications, the
MAX113/MAX117 can be shut down between conver-
sions, reducing supply current to microamp levels (see
Typical Operating Characteristics
). A logic low on the
PWRDN pin shuts the devices down, reducing supply
current typically to 1µA when powered from a single
+3V supply. A logic high on PWRDN wakes up the
MAX113/MAX117, and the selected analog input enters
the track mode. The signal is fully acquired after 900ns
(this includes both the power-up delay and the
track/hold acquisition time), and a new conversion can
be started. If the power-down feature is not required,
connect PWRDN to V
DD
. For minimum current con-
sumption, keep digital inputs at the supply rails in
power-down mode. Refer to the
Reference
section for
information on reducing the reference current during
power-down.
___________________Digital Interface
The MAX113/MAX117 have two basic interface modes,
which are set by the MODE pin. When MODE is low,
the converters are in read mode; when MODE is high,
the converters are set up for write-read mode. The A0,
A1, and A2 inputs control channel selection, as shown
in Table 1. The address must be valid for a minimum
time, t
ACQ
, before the next conversion starts.
DATA
OUTPUTS
DATA
OUTPUTS
C
L
R
L
= 3k
C
L
a) HIGH-Z TO V
OH
b) HIGH-Z TO V
OL
R
L
= 3k
V
DD
Figure 1. Load Circuits for Data-Access Time Test
DATA
OUTPUTS
10pF
3k
10pF
a) V
OH
TO HIGH-Z b) V
OL
TO HIGH-Z
3k
V
DD
DATA
OUTPUTS
Figure 2. Load Circuits for Data-Hold Time Test
Table 1. Truth Table for Input Channel
Selection
MAX113
00 IN1
IN201
IN4
IN3
11
10
IN6
IN5
——
IN8
(reads V
REF+
if selected)
IN7
——
——
——
001
011
010
101
111
110
100
MAX117
000
SELECTED CHANNEL
A2 A1 A0A1 A0
MAX113/MAX117
Read Mode (MODE = 0)
In read mode, conversions and data access are con-
trolled by the RD input (Figure 3). The comparator
inputs track the analog input voltage for the duration of
t
ACQ
. A conversion is initiated by driving CS and RD
low. With µPs that can be forced into a wait state, hold
RD low until output data appears. The µP starts the
conversion, waits, and then reads data with a single
read instruction.
In read mode, WR/RDY is configured as a status output
(RDY), so it can drive the ready or wait input of a µP.
RDY is an open-collector output (no internal pull-up)
that goes low after the falling edge of CS and goes high
at the end of the conversion. If not used, the WR/RDY
pin can be left unconnected. The INT output goes low
at the end of the conversion and returns high on the ris-
ing edge of CS or RD.
Write-Read Mode (MODE = 1)
Figures 4 and 5 show the operating sequence for write-
read mode. The comparator inputs track the analog
input voltage for the duration of t
ACQ
. The conversion is
initiated by a falling edge of WR. When WR returns
high, the result of the four-MSBs flash is latched into the
output buffers and the conversion of the four-LSBs flash
starts. INT goes low, indicating conversion end, and the
lower four data bits are latched into the output buffers.
The data is then accessible after RD goes low (see
Timing Characteristics
).
A minimum acquisition time (t
ACQ
) is required from INT
going low to the start of another conversion (WR going
low).
Options for reading data from the converter include
using internal delay, reading before delay, and pipelined
operation (discussed in the following sections).
Using Internal Delay
The µP waits for the INT output to go low before reading
the data (Figure 4). INT goes low after the rising edge of
WR, indicating that the conversion is complete and the
result is available in the output latch. With CS low, data
outputs D0–D7 can be accessed by pulling RD low. INT
is then reset by the rising edge of CS or RD.
Fastest Conversion:
Reading Before Delay
An external method of controlling the conversion time is
shown in Figure 5. The internally generated delay
(t
INTL
) varies slightly with temperature and supply volt-
age, and can be overridden with RD to achieve the
fastest conversion time. RD is brought low after the ris-
ing edge of WR, but before INT goes low. This com-
pletes the conversion and enables the output buffers
+3V, 400ksps, 4/8-Channel,
8-Bit ADCs with 1µA Power-Down
8 _______________________________________________________________________________________
t
CSS
t
RDY
t
ACQ
t
AH
WITH EXTERNAL
PULL-UP
t
CSH
t
ACQ
t
INTH
t
UP
t
DH
t
CRD
t
ACCO
D0–D7
RDY
RD
CS
PWRDN
INT
A0–A2
VALID DATA
(N)
ADDRESS VALID (N + 1)
ADDRESS VALID
(N)
t
AH
t
AH
t
ACQ
t
DH
t
READ2
t
RD
D0–D7
RD
WR
CS
INT
VALID DATA
(N)
t
INTL
t
ACC2
t
WR
t
CSS
t
CSH
t
ACQ
t
CSS
t
CSH
A0–A2
t
INTH
ADDRESS
VALID (N)
ADDRESS VALID (N + 1)
Figure 3. Read Mode Timing (Mode = 0)
Figure 4. Write-Read Mode Timing (t
RD
> t
INTL
) (Mode = 1)
t
CSS
t
ACQ
t
DH
t
READ1
t
RD
t
INTL
t
ACQ
t
AH
RD
WR
CS
INT
VALID DATA
(N)
t
CSS
t
CSH
t
INTH
t
WR
t
CSH
t
ACC1
t
CWR
t
RI
A0–A2
D0–D7
ADDRESS
VALID (N)
ADDRESS VALID (N + 1)
Figure 5. Write-Read Mode Timing (t
RD
< t
INTL
) (Mode = 1)
that contain the conversion result (D0–D7). INT also
goes low after the falling edge of RD and is reset on the
rising edge of RD or CS. The total conversion time is
therefore: t
WR
+ t
RD
+ t
ACC1
= 1800ns.
Pipelined Operation
Besides the two standard write-read-mode options,
“pipelined” operation can be achieved by connecting
WR and RD together (Figure 6). With CS low, driving
WR and RD low initiates a conversion and concurrently
reads the result of the previous conversion.
_____________Analog Considerations
Reference
Figures 7a, 7b, and 7c show typical reference connec-
tions. The voltages at REF+ and REF- set the ADC’s
analog input range (Figure 10). The voltage at REF-
defines the input that produces an output code of all
zeros, and the voltage at REF+ defines the input that
produces an output code of all ones.
The internal resistance from REF+ to REF- can be as
low as 1k, and current will flow through it even when
the MAX113/MAX117 are shut down. Figure 7d shows
how an N-channel MOSFET can be connected to REF-
to break this current path during power-down. The FET
should have an on-resistance of less than 2with a 3V
gate drive. When REF- is switched, as in Figure 7d, a
new conversion can be initiated after waiting a time
equal to the power-up delay (t
UP
) plus the N-channel
FET’s turn-on time.
Although REF+ is frequently connected to V
DD
, the cir-
cuit of Figure 7d uses a low-current, low-dropout, 2.5V
voltage reference: the MAX872. Since the MAX872
cannot continuously furnish enough current for the ref-
erence resistance, this circuit is intended for applica-
tions where the MAX113/MAX117 are normally in stand-
by and are turned on in order to make measurements
at intervals greater than 100µs. C1 (the capacitor con-
nected to REF+) is slowly charged by the MAX872 dur-
ing the standby period, and furnishes the reference
current during the short measurement period.
The 4.7µF value of C1 ensures a voltage drop of less
than 1/2LSB when performing four to eight successive
conversions. Larger capacitors reduce the error still fur-
ther. Use ceramic or tantalum capacitors for C1.
MAX113/MAX117
+3V, 400ksps, 4/8-Channel,
8-Bit ADCs with 1µA Power-Down
_______________________________________________________________________________________ 9
t
ACQ
t
INTL
RD, WR
INT
NEW DATA (N)
t
WR
t
ACQ
t
AH
t
CSH
t
IHWR
t
CSS
t
ID
OLD DATA (N - 1)
D0–D7
ADDRESS
VALID (N)
ADDRESS 
VALID (N + 1)
A0–A2
CS
Figure 6. Pipelined Mode Timing (WR = RD) (Mode = 1)
REF-
MAX113
MAX117
V
DD
IN_
REF+
V
IN+
V
IN-
GND
+3V
0.1µF
4.7µF
Figure 7a. Power Supply as Reference
+3V
0.1µF
4
REF-
MAX113
MAX117
REF+
IN_
8
1
3
7
0.1µF
4.7µF
2
6
GND
V
DD
+2.5V
34.8k
3.01k
LM10
V
IN+
V
IN-
REF-
MAX113
MAX117
REF+
0.1µF
0.1µF
* CURRENT PATH MUST STILL
EXIST FROM V
IN-
TO GND
R*
IN_
V
IN-
V
DD
V
IN+
GND
+3V
+2.5V
0.1µF
4.7µF
Figure 7b. External Reference, 2.5V Full Scale
Figure 7c. Input Not Referenced to GND

MAX113CAG

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Description:
IC ADC 4CH8BIT 3V 100KSPS 24SSOP
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