RF VSSOP 1 Form A C×R3 (AQY22❍❍❍T)
–6–
ASCTB345E 201407-T
PhotoMOS
®
CAUTIONS FOR USE
SAFETY WARNINGS
• Do not use the product under conditions
that exceed the range of its specifica-
tions. It may cause overheating, smoke,
or fire.
• Do not touch the recharging unit while
the power is on. There is a danger of
electrical shock. Be sure to turn off the
power when performing mounting,
maintenance, or repair operations on the
device (including connecting parts such
as the terminal board and socket).
• Check the connection diagrams in the
catalog and be sure to connect the
terminals correctly.
Erroneous connections could lead to
unexpected operating errors, overheat-
ing, or fire.
1. Derating design
Derating is essential in any reliable
design and is a significant factor for
product life.
Even if the conditions of use
(temperature, current, voltage, etc.) of the
product fall within the absolute maximum
ratings, reliability can be reduced
remarkably when used under high load
(high temperature, high humidity, high
current, high voltage, etc.).
Therefore, please derate sufficiently
below the absolute maximum rating and
verify operation of the actual design
before use.
Also, if there is the possibility that the
inferior quality of this product could
possibility cause great adverse affect on
human life or physical property we
recommend that, from the perspective of
a manufacturer’s liability, sufficient
amount of derating to be added to the
maximum rating value and implement
safety measures such as fail-safe circuit.
2. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate because of the excessive
voltage or current. In extreme cases,
wiring may melt, or silicon P/N junctions
may be destroyed.
Therefore, the circuit should be designed
in such a way that the load never exceed
the absolute maximum ratings, even
momentarily.
3. Deterioration and destruction
caused by discharge of static
electricity
(RF C×R3 / C×R5 / C×R10)
This phenomenon is generally called
static electricity destruction, and occurs
when static electricity generated by
various factors is discharged while the
PhotoMOS
®
terminals are in contact,
producing internal destruction of the
element.
To prevent problems from static
electricity, the following precautions and
measures should be taken when using
your device.
1) Employees handling PhotoMOS
®
should wear anti-static clothing and
should be g
rounded through protective
resistance of 500 kΩ to 1 MΩ.
2) A conductive metal sheet should be
placed over the worktable. Measuring
instruments and jigs should be grounded.
3) When using soldering irons, either use
irons with low leakage current, or ground
the tip of the soldering iron. (Use of low-
voltage soldering irons is also
recommended.)
4) Devices and equipment used in
assembly should also be grounded.
5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an
electrostatic charge.
6) When storing or transporting devices,
the environment should not be conducive
to generating static electricity (for
instance, the humidity should be between
45 and 60%), and PhotoMOS
®
should be
protected using conductive packing
materials.
4. Short across terminals
Do not short circuit between terminals
when PhotoMOS
®
is energized, since
there is possibility of breaking of the
internal IC.
5. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited. Typical circuits are shown
below.
(Typical circuits of AC/DC dual use type
are shown below. It is the same with DC
only type.)
2) Even if spike voltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
6. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) For LED forward current at E
min, please
maintain min. 5 mA.
2) Please make sure for E
max. is no higher
the LED current at than 50 mA.
7. About the exposed terminals on the
sides of the pac
kage
As shown in the following figure, part of
the input and output frames are exposed
on the sides of the package. Due to this,
please be keep in mind the cautions
listed below.
1) Shorting the exposed terminals may
cause deterioration of the insulation
between the inputs and outputs, and may
damage the internal IC.
2) Since the exposed terminals are
connected electrically to the internal
element, please refer to item “3.
Deterioration and destruction caused by
discharge of static electricity”, and
implement sufficient measures to control
static electricity.
3) When mounting the PhotoMOS
®
in the
vicinity, please keep in mind that if the
exposed frames of adjacent PhotoMOS
®
get too close, a short between
PhotoMOS
®
may occur.
8. Regarding close installations
When many PhotoMOS
®
are mounted
close to other parts, the ambient
temperature may rise due to heating of
the internal element when power is
applied. Be sure to use with a reduced
load current after testing under actual
conditions, because the degree of
temperature rise depends on the
mounting layout of the PhotoMOS
®
and
conditions of use.
1
23
Load
4
1
23
Load
4
Add a clamp diode
to the load
Add a CR snubber
circuit to the load
Emin. Emax.
Part of frame of output side
Part of frame of input side
