RF VSSOP 1 Form A C×R3 (AQY22❍❍❍T)
–7–
ASCTB345E 201407-T
9. Soldering
1) When soldering PC board terminals,
keep soldering time to within 10 s at
260°C 500°F.
2) When soldering surface-mount
terminals, SOP, SSOP, SON and VSSOP
package, the following conditions are
recommended.
(1) IR (Infrared reflow) soldering method
*245°C 473°F or less for SON, VSSOP package
(2) Soldering iron method
Tip temperature: 350 to 400°C 662 to
752°F
Wattage: 30 to 60 W
Soldering time: within 3 s
(3) Others
Check mounting conditions before using
other soldering methods (DWS, VPS, hot-
air, hot plate, laser, pulse heater, etc.)
• When using lead-free solder, we
recommend a type with an alloy
composition of Sn 3.0 Ag 0.5 Cu. Please
inquire about soldering conditions and
other details.
• The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
10. Notes for mounting
1) If many different packages are
combined on a single substrate, then
lead temperature rise is highly dependent
on package size. For this reason, please
make sure that the temperature of the
terminal solder area of the PhotoMOS
®
falls within the temperature conditions of
item “9. Soldering” before mounting.
2) If the mounting conditions exceed the
recommended solder conditions in item
“9. Soldering”, resin strength will fall and
the nonconformity of the heat expansion
coefficient of each constituent material
will increase markedly, possibly causing
cracks in the package, severed bonding
wires, and the like. For this reason,
please inquire with us about whether this
use is possible.
11. Cleaning solvents compatibility
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output: No greater than
0.25W/cm
2
• Cleaning time: No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Others: Submerge in solvent in order to
prevent the PC board and elements
from being contacted directly by the
ultrasonic vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
12. Transportation and storage
1) Extreme vibration during transport will
warp the lead or damage the
PhotoMOS
®
. Handle the outer and inner
boxes with care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
• Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70% R.H.
• Atmosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
3) PhotoMOS
®
implemented in VSSOP,
SON, SSOP, SOP are sensitive to
moisture and come in sealed moisture-
proof package. Observe the following
cautions on storage.
• After the moisture-proof package is
unsealed, take the devices out of storage
as soon as possible (within 1 month
45°C 32°F/70%R.H.).
• If the devices are to be left in storage for
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
T1
T2
T3
T1 = 150 to 180°C
T2 = 230°C
T3 = 250°C
t1 = 60 to 120 s or less
t2 = 30 s or less
t1 t2
302 to 356°F
446°F
or less*482°F
