Nexperia
BUK6D43-60E
60 V, N-channel Trench MOSFET
BUK6D43-60E All information provided in this document is subject to legal disclaimers.
©
Nexperia B.V. 2017. All rights reserved
Product data sheet 13 December 2017 5 / 15
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-a)
thermal resistance
from junction to
ambient
in free air [1] - 57 66 K/W
R
th(j-sp)
thermal resistance
from junction to solder
point
- 6 10 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm
2
.
aaa-027718
t
p
(s)
10
-5
10
-4
10
-3
10
-2
10
Z
th(j-sp)
(K/W)
10
-2
10-1
1
duty cycle = 1
0.01
0
0.02
0.05
0.1
0.2
0.25
0.33
0.5
0.75
Fig. 4. Transient thermal impedance from junction to solder point as a function of pulse duration; typical values
aaa-026870
t
p
(s)
10
-3
10
3
10
2
10110
-1
10
-2
10
2
10
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.02
0.01
0
0.05
0.1
0.2
0.25
0.33
0.5
0.75
FR4 PCB, mounting pad for drain 6 cm
2
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
