SMA6F Characteristics
Doc ID 14996 Rev 2 5/9
Figure 6. Peak forward voltage drop versus
peak forward current (typical
values)
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 9. Leakage current versus junction
temperature (typical values)
I (A)
FM
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0
T
j
=25 °C
T
j
=125 °C
V (V)
FM
Z
th(j-a)
/R
th(j-a)
0.00
0.01
0.10
1.00
1.
E-
1.
E-
21.
E-
11.
E+
1.
E+
11.
E+
21.
E+
On recommended pad layout.
Printed circuit board, FR4
copper thickness = 35 µm
copper surface = 1 cm²
t (S)
p
R
th(j-a)
(°C/W)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
S (cm )
CU
2
Printed circuit board, FR4
copper thickness = 35 µm
I (nA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150 175
V
R
=V
RM
V
BR
=11.7V
V
BR
>11.7V
T (°C)
j
