STTH2R02 Ordering information scheme
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L
2 Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under each lead - SMA/SMB
(epoxy FR4, e
cu
= 35 µm)
Figure 13. Thermal resistance, junction to
ambient, versus copper surface
under each lead DO-15
(epoxy FR4, e
cu
= 35 µm)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]/Q
RR
;I
RM
[T
j
=125°C]
I
RM
Q
RR
I
F
=2A
V
R
=160V
T
j
(°C)
0
20
40
60
80
100
120
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMA
SMB
S
CU
(cm²)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
DO-15
S
CU
(cm²)
STTH 2 R 02 XXX
Ultrafast switching diode
Average forward current
2 = 2 A
02 = 200 V
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
A = SMA in Tape and reel
U = SMB in Tape and reel
Model R
Package
Repetitive peak reverse voltage