BAS16LD All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved.
Product data sheet Rev. 1 — 12 October 2010 7 of 11
NXP Semiconductors
BAS16LD
Single high-speed switching diode
9. Package outline
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Fig 8. Package outline BAS16LD (SOD882D)
10-08-06Dimensions in mm
0.65
0.30
0.22
0.30
0.22
0.55
0.45
0.65
0.55
0.4
max
1.05
0.95
2
cathode marking on top side
1
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
10000
BAS16LD SOD882D 2 mm pitch, 8 mm tape and reel -315
Reflow soldering is the only recommended soldering method.
Fig 9. Reflow soldering footprint BAS16LD (SOD882D)
solder lands
solder resist
solder paste
sod882d_
Dimensions in mm
1.4
0.2
0.3
0.4
1
1.3
0.8
(2×)
0.6
(2×)
0.7
(2×)