14 2007 Semtech Corp. www.semtech.com
POWER MANAGEMENT
SC4519H
Contact Information
Semtech Corporation
Power Management Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Land Pattern - SOIC-8L EDP
Outline Drawing - SOIC-8L EDP
SEE DETAIL
DETAIL
A
A
.050 BSC
.236 BSC
8
.010
.150
.189
.154
.193
.012
-
8
0.25
1.27 BSC
6.00 BSC
3.90
4.90
-
.157
.197
3.80
4.80
.020 0.31
4.00
5.00
0.51
bxN
2X N/2 TIPS
SEATING
aaa C
E/22X
12
N
A
D
A1
E1
bbb C A-B D
ccc C
e/2
E
A2
(.041)
.004
.008
-
.028
-
-
-
-
0°
.016
.007
.049
.000
.053
8° 0°
0.20
0.10
-
8°
0.40
0.17
1.25
0.00
.041
.010
.069
.065
.005
1.35
(1.05)
0.72
-
1.04
0.25
-
-
-
1.75
1.65
0.13
0.25
-
.010 .020 0.50
-
c
L
(L1)
01
0.25
GAGE
PLANE
h
3.
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
-B-
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
DATUMS AND TO BE DETERMINED AT DATUM PLANE
NOTES:
1.
2. -A-
-H-
SIDE VIEW
A
B
C
D
e
H
PLANE
EXPOSED PAD
L1
N
01
bbb
aaa
ccc
A
b
A2
A1
D
E
E1
L
h
e
c
DIM
MIN
MILLIMETERS
NOM
DIMENSIONS
INCHES
MIN MAX MAXNOM
F
h
H
F
H
.085
.120
.095
.116 .130
.099
2.95
2.15
3.05
2.41
3.30
2.51
4.
REFERENCE JEDEC STD MS-012, VARIATION BA.
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
REFERENCE IPC-SM-782A, RLP NO. 300A.2.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
E
Z
(C)
G
P
Ø 0.36mm
THERMAL VIA
X
Y
SOLDER MASK
(5.20)
C
(.205)
X
Y
Z
F
G
P
D
E
.024
.087
.291
.101
.118
.050
.201
.134
0.60
2.20
7.40
2.56
3.00
1.27
5.10
3.40
MILLIMETERSINCHESDIM
DIMENSIONS
D
F
