NXP Semiconductors
BGU7045
1 GHz wideband low-noise amplifier with bypass
BGU7045 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2018. All rights reserved.
Product data sheet Rev. 3 — 11 April 2018
6 / 12
8.3 Application circuit board layout
001aan459
X1 X2
C5
R2
C3
C1
C2
L1
R1
C4
RF_OUTRF_IN
PCB material = FR4.
PCB thickness = 1.6 mm.
PCB size = 30 mm x 30 mm.
ε
r
= 4.5; thickness of copper layer = 35 µm.
Components are listed in Table 9.
Figure 3. BGU7045 application circuit board layout.
Table 9. List of components
See Figure 1 and Figure 3 .
Component Description Value Remarks Function
C1, C2 capacitor 10 nF DC blocking
C3, C4 capacitor 10 nF decoupling
C5 capacitor 10 µF decoupling
L1 chip ferrite bead 1.5 kΩ
[1]
Murata BLM18HE152SN1DF RF choke
R1 resistor 18 Ω
[1]
R
bias
bias setting
R2 resistor 1.8 kΩ current limiting
X1, X2 connector 75 Ω F-connector, edge mount PCB
reflow type, Bomar 861V509ER6
input/output
[1] L1 and R1 must have a power rating of 0.1 W or higher.