NCV4299
http://onsemi.com
4
MAXIMUM RATINGS
Rating Symbol Min Max Unit
Input Voltage to Regulator (DC) V
I
-40 45 V
Input Peak Transient Voltage to Regulator wrt GND - - 60 V
Inhibit (INH) (Note 1) V
INH
-40 45 V
Sense Input (SI) V
SI
-0.3 45 V
Sense Input (SI) I
SI
-1.0 1.0 mA
Reset Threshold (RADJ) V
RE
-0.3 7.0 V
Reset Threshold (RADJ) I
RE
-10 10 mA
Reset Delay (D) V
D
-0.3 7.0 V
Reset Output (RO) V
RO
-0.3 7.0 V
Sense Output (SO) V
SO
-0.3 7.0 V
Output (Q) V
Q
-0.3 16 V
Output (Q) I
Q
-5.0 - mA
ESD Capability, Human Body Model (Note 5) ESD
HB
2.0 - kV
ESD Capability, Machine Model (Note 5) ESD
MM
200 - V
ESD Capability, Charged Device Model (Note 5) ESD
CDM
1.0 - kV
Junction Temperature T
J
- 150 °C
Storage Temperature T
stg
-50 150 °C
OPERATING RANGE
Input Voltage
5.0 V Version
3.3 V Version
V
I
4.5
4.4
45
45
V
Junction Temperature T
J
-40 150 °C
LEAD TEMPERATURE SOLDERING REFLOW (Note 3)
Lead Temperature Soldering (Note 5)
Reflow (SMD styles only), leaded
60-150 sec above 183, 30 sec max at peak
T
SLD
- 240 Pk
°C
Reflow (SMD styles only), lead free
60s-150 sec above 217, 40 sec max at peak
T
SLD
- 265 Pk
°C
Moisture Sensitivity Level MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. 14 pin package only.
2. Preliminary numbers.
3. Per
IPC / JEDEC J-STD-020C.
4. Measured to Pin 4. All ground pins connected to ground.
5. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC-Q100-002 (EIA/JESD22-A114)
ESD MM tested per AEC-Q100-003 (EIA/JESD22-A115)
ESD CDM tested per EIA/JES D22/C101, Field Induced Charge Model.