MMU 0102, MMA 0204, MMB 0207 - Professional
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Vishay Beyschlag
Revision: 29-Mar-16
11
Document Number: 28713
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Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2)
Special requirements apply to MICRO-MELF, MMU 0102:
• R < 100 ± (0.25 % R + 10 m)
• 100 R 221 k ± 0.1 % R
• 221 k < R: ± 0.25 % R
4.39 -
Periodic
electric
overload:
Standard
operation
mode
U = or
U = 2 x U
max.
;
whichever is the less severe;
0.1 s on; 2.5 s off;
1000 cycles
± (0.5 % R + 5 m)
Periodic
electric
overload:
Power
operation
mode
± (1 % R + 5 m)
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance; amplitude
1.5 mm or 200 m/s
2
; 7.5 h
±(0.05 % R + 5 m)
±(0.1 % R
+ 5 m)
4.38 -
Electrostatic
discharge
(Human Body
Model)
IEC 61340-3-1
(1)
;
3 pos. + 3 neg. discharges
MMU 0102: 1.5 kV
MMA 0204: 2 kV
MMB 0207: 4 kV
± (0.5 % R + 0.05 )
4.17 58 (Td) Solderability
Solder bath method;
SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered); no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning ( 95 % covered); no visible damage
4.18 58 (Td)
Resistance
to soldering
heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
±(0.05 % R
+ 10 m)
±(0.1 % R
+ 10 m)
±(0.25 % R
+ 10 m)
±(0.25 % R
+ 10 m)
Reflow method 2
(IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
±(0.02 % R
+ 10 m)
±(0.05 % R
+ 10 m)
±(0.05 % R
+ 10 m)
±(0.1 % R
+ 10 m)
4.29 45 (XA)
Component
solvent
resistance
Isopropyl alcohol;
50 °C; method 2
No visible damage
4.30 45 (XA)
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible; no visible damage
4.32 21 (Ue
3
)
Shear
(adhesion)
45 N No visible damage
4.33 21 (Ue
1
)
Substrate
bending
Depth 2 mm,
3 times
No visible damage, no open circuit in bent position
± (0.05 % R + 5 m)
(2)
4.7 - Voltage proof U
RMS
= U
ins
; 60 s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
,
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN
60 115-1
CLAUSE
IEC
60 068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
Stability for product types:
STABILITY
CLASS 0.25
OR BETTER
STABILITY
CLASS 0.5
OR BETTER
STABILITY
CLASS 1
OR BETTER
STABILITY
CLASS 2
OR BETTER
MMU 0102 10 to 221 k 1 to < 10 < 1 > 221 k
MMA 0204 10 to 332 k 1 to < 10 < 1 > 332 k
MMB 0207 10 to 1 M 1 to < 10 < 1 > 1 M
