VS-FC420SA10
www.vishay.com
Vishay Semiconductors
Revision: 27-Sep-17
2
Document Number: 95793
For technical questions within your region: DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Junction and storage temperature range T
J
, T
Stg
-55 - 175 °C
Junction to case MOSFET R
thJC
- - 0.23
°C/W
Case to heat sink Module R
thCS
Flat, greased surface - 0.1 -
Weight -30 - g
Mounting torque
Torque to terminal - - 1.1 (9.7) Nm (lbf.in)
Torque to heatsink - - 1.8 (15.9) Nm (lbf.in)
Case style SOT-227
ELECTRICAL CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Drain to source breakdown voltage V
(BR)DSS
V
GS
= 0 V, I
D
= 750 μA 100 - - V
Static drain to source on-resistance R
DS(on)
V
GS
= 10 V, I
D
= 200 A - 1.3 2.15 m
Gate threshold voltage V
GS(th)
V
DS
= V
GS
, I
D
= 750 μA 2.2 2.9 3.8 V
Forward transconductance g
fs
V
DS
= 20 V, I
D
= 20 A, V
GS
= 10 V - 94 - S
Drain to source leakage current I
DSS
V
DS
= 100 V, V
GS
= 0 V - 0.6 4
μA
V
DS
= 100 V, V
GS
= 0 V, T
J
= 125 °C - 32 -
Gate to source leakage I
GSS
V
GS
= ± 20 V - - ± 350 nA
Total gate charge Q
g
I
D
= 200 A
V
DS
= 50 V
V
GS
= 10 V
- 375 -
nCGate to source charge Q
gs
-84 -
Gate to drain (“Miller”) charge Q
gd
- 138 -
Turn-on delay time t
d(on)
V
DD
= 50 V
I
D
= 100 A
R
g
= 1.2
V
GS
= 10 V
-45 -
ns
Rise time t
r
- 275 -
Turn-off delay time t
d(off)
- 152 -
Fall time t
f
- 172 -
Input capacitance C
iss
V
GS
= 0 V
V
DS
= 25 V
f = 1 MHz
- 17.3 -
nFOutput capacitance C
oss
-9.2 -
Reverse transfer capacitance C
rss
-0.9 -
SOURCE-DRAIN RATINGS AND CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Continuous source current (body diode) I
S
MOSFET symbol
showing the integral
reverse p-n junction
diode
- - 435
A
Pulsed source current (body diode) I
SM
- - 1130
Diode forward voltage V
SD
I
S
= 200 A, V
GS
= 0 V - 0.91 1.5 V
Reverse recovery time t
rr
T
J
= 25 °C, I
F
= I
S
= 50 A,
dI/dt = 100 A/μs, V
R
= 50 V
- 171 - ns
Reverse recovery charge Q
rr
- 740 - nC
Reverse recovery current I
RM
-8.7 - A
S
D
G