LPC47N217-JV

LPC47N217
DS00001810A-page 4 2006 - 2014 Microchip Technology Inc.
PACKAGE OUTLINE
Note 1: Controlling Unit: millimeter.
2: Tolerance on the true position of the leads is ± 0.035 mm maximum.
3: Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side. D1 and E1 dimensions determined at datum plane H.
4: Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5: Details of pin 1 identifier are optional but must be located within the zone indicated.
Note: For the most current package drawings, see the Microchip Packaging Specification at http://www.microchip.com/packaging.
FIGURE 2: 64-PIN STQFP PACKAGE, 7 X 7 X 1.4 BODY, 2 MM FOOTPRINT
Min Nominal Max Remarks
A ~ ~ 1.60 Overall Package Height
A1 0.05 ~ 0.15 Standoff
A2 1.35 1.40 1.45 Body Thickness
D 8.80 9.00 9.20 X Span
D1 6.80 7.00 7.20 X body Size
E 8.80 9.00 9.20 Y Span
E1 6.80 7.00 7.20 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.45 0.60 0.75 Lead Foot Length
L1 ~ 1.00 REF. ~ Lead Length
e 0.40 Basic Lead Pitch
θ 0
o
~7
o
Lead Foot Angle
W 0.13 0.18 0.23 Lead Width
ccc ~ ~ 0.08 Coplanarity
2006 - 2014 Microchip Technology Inc. DS00001810A-page 5
LPC47N217
APPENDIX A: PRODUCT BRIEF REVISION HISTORY
TABLE A-1: REVISION HISTORY
Revision Section/Figure/Entry Correction
DS00001810A (08-07-14) Replaces previous SMSC version Rev.0.2 (09-21-06)
LPC47N217
DS00001810A-page 6 2006 - 2014 Microchip Technology Inc.
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To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notifi-
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CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
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Technical support is available through the web site at: http://www.microchip.com/support

LPC47N217-JV

Mfr. #:
Manufacturer:
Microchip Technology
Description:
I/O Controller Interface IC 64-Pin Mobile I/O
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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