Microchip Technology Drawing No. C04-057-OA Rev D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2017 Microchip Technology Inc.
R
Foot Angle 0° - 8°
15°-5°
Mold Draft Angle Bottom
15°-5°
Mold Draft Angle Top
0.51-0.31
b
Lead Width
0.25-0.17
c
Lead Thickness
1.27-0.40LFoot Length
0.50-0.25hChamfer (Optional)
4.90 BSCDOverall Length
3.90 BSCE1Molded Package Width
6.00 BSCEOverall Width
0.25-0.10
A1
Standoff
--1.25A2Molded Package Thickness
1.75--AOverall Height
1.27 BSC
e
Pitch
8NNumber of Pins
MAXNOMMINDimension Limits
MILLIMETERSUnits
protrusions shall not exceed 0.15mm per side.
3. Dimensions D and E1 do not include mold
flash or protrusions. Mold flash or
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Pi
n 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic
4. Dimensioning and tolerancing per ASME Y14.5M
Notes:
§
Footprint
L1 1.04 REF
5. Datums A & B to be determined at Datum H.
8-Lead Plastic Small Outline - Narrow, 3.90 mm (.150 In.) Body [SOIC]
Atmel Legacy
