APTM50DHM38G

APTM50DHM38G
APTM50DHM38G – Rev 3 July, 2006
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.
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6
G1
S1
S4
G4
CR3
VBUS
OUT2
0/VBUS
Q4
OUT1
CR2
Q1
S4
G4
VBUS 0/VBUS
S1
G1
OUT1
OUT2
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
S
ymbol Parameter Max ratings Unit
V
DSS
Drain - Source Breakdown Voltage 500 V
T
c
= 25°C 90
I
D
Continuous Drain Current
T
c
= 80°C 67
I
DM
Pulsed Drain current 360
A
V
GS
Gate - Source Voltage ±30 V
R
DSon
Drain - Source ON Resistance 45
m
P
D
Maximum Power Dissipation T
c
= 25°C 694 W
I
AR
Avalanche current (repetitive and non repetitive) 46 A
E
AR
Repetitive Avalanche Energy 50
E
AS
Single Pulse Avalanche Energy 2500
mJ
V
DSS
= 500V
R
DSon
= 38m typ @ Tj = 25°C
I
D
= 90A @ Tc = 25°C
Applicatio
n
Welding converters
Switched Mode Power Supplies
Switched Reluctance Motor Drives
Features
Power MOS 7
®
MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate c harge
- Avalanche energy rated
- Very rugged
Kelvin source for easy drive
Very low stray inductance
- Symmetrical design
- M5 power connectors
High level of integration
Benefits
Outsta ndi ng perfor mance at high freq ue nc y operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Low profile
RoHS Compliant
Asymmetrical - bridge
MOSFET Power Module
APTM50DHM38G
APTM50DHM38G – Rev 3 July, 2006
www.microsemi
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com 2
6
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
GS
= 0V,V
DS
= 500V T
j
= 25°C 200
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 400V T
j
= 125°C 1000
µA
R
DS(on)
Drain – Source on Resistance V
GS
= 10V, I
D
= 45A
38 45
m
V
GS(th)
Gate Threshold Voltage V
GS
= V
DS
, I
D
= 5mA 3 5 V
I
GS S
Gate – Source Leakage Current V
GS
= ±30 V, V
DS
= 0V ±150 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
is s
Input Capacitance 11.2
C
oss
Output Capacitance 2.4
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
0.18
nF
Q
g
Total gate Charge 246
Q
gs
Gate – Source Charge 66
Q
gd
Gate – Drain Charge
V
GS
= 10V
V
Bus
= 250V
I
D
= 90A
130
nC
T
d(on)
Tur n-o n Delay Ti me 18
T
r
Rise Time 35
T
d(off)
Turn-off Delay Time 87
T
f
Fall Time
Inductive switching @ 125°C
V
GS
= 15V
V
Bus
= 333V
I
D
= 90A
R
G
= 2
77
ns
E
on
Turn-on Switching Energy 1510
E
off
Turn-off Switching Energy
Inductive switching @ 25°C
V
GS
= 15V, V
Bus
= 333V
I
D
= 90A,
R
G
= 2 1452
µJ
E
on
Turn-on Switching Energy 2482
E
off
Turn-off Switching Energy
Inductive switching @ 125°C
V
GS
= 15V, V
Bus
= 333V
I
D
= 90A,
R
G
= 2
1692
µJ
Diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
RRM
Maximum Peak Repetitive Reverse Voltage 600 V
T
j
= 25°C 250
I
RM
Maximum Reverse Leakage Current V
R
=600V
T
j
= 125°C 500
µA
I
F
DC Forward Current T
c
= 80°C 100 A
I
F
= 100A 1.6 1.8
I
F
= 200A 1.9 V
F
Diode Forward Voltage
I
F
= 100A T
j
= 125°C
1.4
V
T
j
= 25°C 180
t
rr
Reverse Recovery Time
T
j
= 125°C 220
ns
T
j
= 25°C 390
Q
rr
Reverse Recovery Charge
I
F
= 100A
V
R
= 400V
di/dt = 200A/µs
T
j
= 125°C 1450
nC
APTM50DHM38G
APTM50DHM38G – Rev 3 July, 2006
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6
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
Transistor 0.18
R
thJC
Junction to Case Thermal Resistance
Diode 0.6
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V
T
J
Operating junction temperature range
-40 150
T
STG
Storage Temperature Range -40 125
T
C
Operating Case Temperature -40 100
°C
To heatsink M6 3 5
Torque Mounting torque
For terminals M5 2 3.5
N.m
Wt Package Weight 280 g
SP6 Package outline (dimensions in mm)
See application note APT0601 - Mounting Instructions for SP6 Power Modules on www.microsemi.com

APTM50DHM38G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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