SPA2410LR5H-B
10. ADDITIONAL NOTES
(A) MSL (moisture sensitivity level) Class 1.
(B) Maximum of 3 reflow cycles is recommended.
(C) In order to minimize device damage:
x Do not board wash or clean after the reflow process.
x Do not brush board with or without solvents after the reflow process.
x Do not directly expose to ultrasonic processing, welding, or cleaning.
x Do not insert any object in port hole of device at any time.
x Do not apply over 30 psi of air pressure into the port hole.
x Do not pull a vacuum over port hole of the microphone.
x Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.
11. MATERIALS STATEMENT
Meets the requirements of the European RoHS directive 2011/65/EC as amended.
Meets the requirements of the industry standard IEC 61249-2-21:2003 for halogenated
substances and Knowles Green Materials Standards Policy section on Halogen-Free.
Ozone depleting substances are not used in the product or the processes used to make the
product, including compounds listed in Annex A, B, and C of the “Montreal Protocol on
Substances That Deplete the Ozone Layer.”
Revision: D 5/20/2013
Sheet 9 of
11 ©2013 Knowles Electronics