VCNT2020
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Vishay Semiconductors
Rev. 1.2, 21-Feb-18
4
Document Number: 84285
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Fig. 10 - Relative Collector Current vs. Displacement Fig. 11 - Rise / Fall Time vs. Collector Current
FLOOR LIFE
Time between soldering and removing from MBB must not
exceed the time indicated in J-STD-020:
Moisture sensitivity: level 4
Floor life: 72 h
Conditions: T
amb
< 30 °C, RH < 60 %
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or
recommended conditions:
192 h at 40 °C (+ 5 °C), RH < 5 %
or
96 h at 60 °C (+ 5 °C), RH < 5 %
REFLOW SOLDER PROFILE
Fig. 12 - Lead (Pb)-free Reflow Solder Profile
According to J-STD-020
0
10
20
30
40
50
60
70
80
90
100
110
0 0.25 0.5 0.75 1.00 1.25 1.50 2.25
I
C, rel
- Relative Collector Current (%)
s - Displacement (mm)
Y-direction
X-direction
1.75 2.00
2.5
2.0
0
10
20
30
40
50
60
70
80
90
100
0 500 2000
t
r
/ t
f
- Rise / Fall Time (s)
I
C
- Collector Current (μA)
U
CE
= 5 V
λ = 960 nm
R
L
= 100 Ω
1000 1500
t
r
t
f
240 °C
Max. 260 °C
217 °C
255 °C
19841
10
100
1000
10000
0
100
200
300
0 50 100 150 200 300
Axis Title
1st line
2nd line
2nd line
Temperature (°C)
Time (s)
50
150
250
250
245 °C
Max. 100 s
Max. 30 s
Max. 120 s
Max. ramp down 6 °C/s
Max. ramp up 3 °C/s
