PHD23NQ10T,118

Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP23NQ10T, PHB23NQ10T
PHD23NQ10T
FEATURES SYMBOL QUICK REFERENCE DATA
’Trench’ technology
• Low on-state resistance V
DSS
= 100 V
• Fast switching
• Low thermal resistance I
D
= 23 A
R
DS(ON)
70 m
GENERAL DESCRIPTION
N-channel enhancement mode field-effect power transistor in a plastic envelope using ’trench’ technology.
Applications:-
• d.c. to d.c. converters
• switched mode power supplies
• T.V. and computer monitor power supplies
The PHP23NQ10T is supplied in the SOT78 (TO220AB) conventional leaded package.
The PHB23NQ10T is supplied in the SOT404 (D
2
PAK) surface mounting package.
The PHD23NQ10T is supplied in the SOT428 (DPAK) surface mounting package.
PINNING SOT78 (TO220AB) SOT404 (D
2
PAK) SOT428 (DPAK)
PIN DESCRIPTION
1 gate
2 drain
1
3 source
tab drain
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DSS
Drain-source voltage T
j
= 25 ˚C to 175˚C - 100 V
V
DGR
Drain-gate voltage T
j
= 25 ˚C to 175˚C; R
GS
= 20 k - 100 V
V
GS
Gate-source voltage - ± 20 V
I
D
Continuous drain current T
mb
= 25 ˚C; V
GS
= 10 V - 23 A
T
mb
= 100 ˚C; V
GS
= 10 V - 16 A
I
DM
Pulsed drain current T
mb
= 25 ˚C - 92 A
P
D
Total power dissipation T
mb
= 25 ˚C - 100 W
T
j
, T
stg
Operating junction and - 55 175 ˚C
storage temperature
d
g
s
123
tab
13
tab
2
1
2
3
tab
1 It is not possible to make connection to pin:2 of the SOT404 or SOT428 packages.
August 1999 1 Rev 1.100
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP23NQ10T, PHB23NQ10T
PHD23NQ10T
AVALANCHE ENERGY LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
E
AS
Non-repetitive avalanche Unclamped inductive load, I
AS
= 14 A; - 93 mJ
energy t
p
= 100 µs; T
j
prior to avalanche = 25˚C;
V
DD
25 V; R
GS
= 50 ; V
GS
= 10 V; refer
to fig:15
I
AS
Peak non-repetitive - 23 A
avalanche current
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
R
th j-mb
Thermal resistance junction - - 1.5 K/W
to mounting base
R
th j-a
Thermal resistance junction SOT78 package, in free air - 60 - K/W
to ambient SOT404 package, pcb mounted, minimum - 50 - K/W
footprint
ELECTRICAL CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
Drain-source breakdown V
GS
= 0 V; I
D
= 0.25 mA; 100 - - V
voltage T
j
= -55˚C 89 - - V
V
GS(TO)
Gate threshold voltage V
DS
= V
GS
; I
D
= 1 mA 2 3 4 V
T
j
= 175˚C 1 - - V
T
j
= -55˚C - - 6 V
R
DS(ON)
Drain-source on-state V
GS
= 10 V; I
D
= 13 A - 49 70 m
resistance T
j
= 175˚C - 132 189 m
I
GSS
Gate source leakage current V
GS
= ± 20 V; V
DS
= 0 V - 10 100 nA
I
DSS
Zero gate voltage drain V
DS
= 100 V; V
GS
= 0 V - 0.05 10 µA
current T
j
= 175˚C - - 500 µA
Q
g(tot)
Total gate charge I
D
= 23 A; V
DD
= 80 V; V
GS
= 10 V - 22 - nC
Q
gs
Gate-source charge - 5 - nC
Q
gd
Gate-drain (Miller) charge - 10 - nC
t
d on
Turn-on delay time V
DD
= 50 V; R
D
= 2.2 ;-8-ns
t
r
Turn-on rise time V
GS
= 10 V; R
G
= 5.6 -39-ns
t
d off
Turn-off delay time Resistive load - 26 - ns
t
f
Turn-off fall time - 24 - ns
L
d
Internal drain inductance Measured tab to centre of die - 3.5 - nH
L
d
Internal drain inductance Measured from drain lead to centre of die - 4.5 - nH
(SOT78 package only)
L
s
Internal source inductance Measured from source lead to source - 7.5 - nH
bond pad
C
iss
Input capacitance V
GS
= 0 V; V
DS
= 25 V; f = 1 MHz - 890 1187 pF
C
oss
Output capacitance - 139 167 pF
C
rss
Feedback capacitance - 83 109 pF
August 1999 2 Rev 1.100
Philips Semiconductors Product specification
N-channel TrenchMOS transistor PHP23NQ10T, PHB23NQ10T
PHD23NQ10T
REVERSE DIODE LIMITING VALUES AND CHARACTERISTICS
T
j
= 25˚C unless otherwise specified
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
I
S
Continuous source current - - 23 A
(body diode)
I
SM
Pulsed source current (body - - 92 A
diode)
V
SD
Diode forward voltage I
F
= 11 A; V
GS
= 0 V - 0.9 1.2 V
t
rr
Reverse recovery time I
F
= 11 A; -dI
F
/dt = 100 A/µs; - 64 - ns
Q
rr
Reverse recovery charge V
GS
= 0 V; V
R
= 25 V - 120 - nC
August 1999 3 Rev 1.100

PHD23NQ10T,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
MOSFET N-CH 100V 23A DPAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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