HSMP-389C-TR1G Datasheet HSMP-389L-TR1G, HSMP-3890-TR2G, HSMP-3894-BLKG | P1-P3

HSMP-389x Series, HSMP-489x Series

Surface Mount RF PIN Switch Diodes

Data Sheet

Features

• Unique Congurations in Surface Mount Packages

– Add Flexibility

– Save Board Space

– Reduce Cost

• Switching

– Low Capacitance

– Low Resistance at Low Current

• Low Failure in Time (FIT) Rate

[1]

• Matched Diodes for Consistent Performance

• Better Thermal Conductivity for Higher Power

Dissipation

• Lead-free

Note:

1. For more information see the Surface Mount PIN Reliability Data

Sheet.

Description/Applications

The HSMP-389x series is optimized for switching appli-

cations where low resistance at low current and low ca-

pacitance are required. The HSMP-489x series products

feature ultra low parasitic inductance. These products

are specically designed for use at frequencies which

are much higher than the upper limit for conventional

PIN diodes.

Pin Connections and Package Marking

Notes:

1. Package marking provides orientation, identication, and date

code.

2. See “Electrical Specications” for appropriate package marking.

GUx

1

2

3

6

5

4

2

Package Lead Code

Identication,

SOT-23/143

(Top View)

Package Lead Code Identication,

SOT-323

(Top View)

Package Lead Code Identication,

SOT-363

(Top View)

Absolute Maximum Ratings

[1]

T

C

= +25°C

Symbol Parameter Unit SOT-23/143 SOT-323/363

I

f

Forward Current (1 µs Pulse) Amp 1 1

P

IV

Peak Inverse Voltage V 100

100

T

j

Junction Temperature °C 150 150

T

stg

Storage Temperature °C -65 to 150 -65 to 150

θ

jc

Thermal Resistance

[2]

°C/W 500 150

ESD WARNING:

Handling Precautions Should Be Taken To Avoid Static Discharge.

Notes:

1. Operation in excess of any one of these conditions may result in permanent damage to the device.

2. T

C

= +25°C, where T

C

is dened to be the temperature at the package pins where contact is made to the circuit board.

SERIES–

SHUNT PAIR

LOW

INDUCTANCE

SINGLE

T

UNCONNECTED

TRIO

L

1 2 3

6 5 4

1 2 3

6 5 4

1 2 3

6 5 4

U

HIGH

FREQUENCY

SERIES

V

1 2 3

6 5 4

DUAL SWITCH

MODEL

R

1 2 3

6 5 4

COMMON

CATHODE

F

COMMON

ANODE

E

SERIES

C

SINGLE

B

DUAL ANODE

489B

COMMON

CATHODE

#4

COMMON

ANODE

#3

SERIES

#2

SINGLE

#0

UNCONNECTED

PAIR

#5

DUAL ANODE

4890

RING

QUAD

#7

1

3

2

4

UNDER DEVELOPMENT

3

Electrical Specications, T

C

= 25°C, each diode

Package Minimum Maximum Maximum

Part Number Marking Lead Breakdown Series Resistance Total Capacitance

HSMP- Code Code Conguration Voltage V

BR

(V) R

S

(ý) C

T

(pF)

3890 G0

[1]

0 Single 100 2.5 0.30

3892 G2

[1]

2 Series

3893 G3

[1]

3 Common Anode

3894 G4

[1]

4 Common Cathode

3895 G5

[1]

5 Unconnected Pair

389B G0

[2]

B Single

389C G2

[2]

C Series

389E G3

[2]

E Common Anode

389F G4

[2]

F Common Cathode

389L GL

[2]

L Unconnected Trio

389R S

[2]

R Dual Switch Mode

389T Z

[2]

T Low Inductance Single

389U GU

[2]

U Series-Shunt Pair

389V GV

[2]

V High Frequency Series Pair

Test Conditions V

R

= V

BR

I

F

= 5 mA V

R

= 5 V

Measure f = 100 MHz f = 1 MHz

I

R

10 µA

Notes:

1. Package marking code is white.

2. Package is laser marked.

High Frequency (Low Inductance, 500 MHz– 3 GHz) PIN Diodes

Minimum Maximum Typical Maximum Typical

Part Package Breakdown Series Total Total Total

Number Marking Voltage Resistance Capacitance Capacitance Inductance

HSMP- Code

[1]

Conguration V

BR

(V) R

S

(ý) C

T

(pF) C

T

(pF) L

T

(nH)

489x GA Dual Anode 100 2.5 0.33 0.375 1.0

Test Conditions V

R

= V

BR

I

F

= 5 mA f = 1 MHz V

R

= 5 V f=500 MHz–

Measure V

R

= 5 V f = 1 MHz 3 GHz

I

R

10 µA

Note:

1. SOT-23 package marking code is white; SOT-323 is laser marked.

Typical Parameters at T

C

= 25°C

Part Number Series Resistance Carrier Lifetime Total Capacitance

HSMP- R

S

(ý) τ (ns) C

T

(pF)

389x 3.8 200 0.20 @ 5V

Test Conditions I

F

= 1 mA I

F

= 10 mA

f = 100 MHz I

R

= 6 mA

HSMP-389C-TR1G

HSMP-389C-TR1G

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