LT3959
23
3959fa
For more information www.linear.com/LT3959
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
5.00 ± 0.10
6.00 ± 0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
1
363530 31 32 33 34
28
20
21
23
24
25
27
2
3
4
6
8
9
10
121314151617
BOTTOM VIEW—EXPOSED PAD
2.00 REF
1.50 REF
0.75 ± 0.05
R = 0.125
TYP
R = 0.10
TYP
PIN 1 NOTCH
R = 0.30 OR
0.35 × 45°
CHAMFER
0.25 ± 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UHE36(28)MA) QFN 0112 REV D
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 ±0.05
4.10 ± 0.05
5.50 ± 0.05
PACKAGE OUTLINE
1.88 ± 0.10
1.53 ± 0.10
2.00 REF
1.50 REF
5.10 ± 0.05
6.50 ± 0.05
UHE Package
Variation: UHE36(28)MA
36(28)-Lead Plastic QFN (5mm × 6mm)
(Reference LTC DWG # 05-08-1836 Rev D)
3.00 ± 0.10
3.00 ± 0.10
0.12
± 0.10
1.88
± 0.05
1.53
± 0.05
3.00 ± 0.05
3.00 ± 0.05
0.48 ± 0.05
0.12
± 0.05
0.48 ± 0.10
0.25 ±0.05
0.50 BSC
101 2 3 4 6 8 9
17
20212324252728
30
31
32
33
34
35
36
12
13
14
15
16
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
