NCN8025 / NCN8025A
www.onsemi.com
13
As illustrated by Figure 8 the device has a debounce timer
of 8 ms typical duration. When a card is inserted, output INT
goes High only at the end of the debounce time. When the
card is removed a deactivation sequence is automatically
and immediately performed and INT
goes Low.
ESD PROTECTION
The NCN8025 / NCN8025A includes devices to protect
the pins against the ESD spike voltages. To cope with the
different ESD voltages developed across these pins, the built
in structures have been designed to handle either 2 kV, when
related to the micro controller side, or 8 kV when connected
with the external contacts (HBM model). Practically, the
CRST, CCLK, CI/O, CAUX1, CAUX2, PRES and PRES
pins can sustain 8 kV. The CVCC pin has the same ESD
protection and can source up to 70 mA continuously, the
absolute maximum current being internally limited with a
max at 150 mA. The CVCC current limit depends on V
DDP
and CVCC.
APPLICATION SCHEMATIC
3.3 V Microcontroller
VCC
RST
CLK
C4
GND
VPP
I/O
C8
1
2
3
4
5
6
7
8
SMART CARD
R1
R2
VDD
+3.3 V
DET
Normally Open
VDD
+3.3 V
VDDP
+5 V
+
100 nF
XTAL1 XTAL2
100 nF
CAUX2
CI/O
PRES
VDDP
VDD
RSTIN
CLKIN
VSEL0
1
2
3
4
5
6
789101112
17
16
15
14
13
24 23 22 21 20 19
18
Exposed Pad
25
GND
220 nF
100 nF
GND
100 nF
Figure 9. Application Schematic
VSEL1
CLKDIV2
CLKDIV1
AUX2uc
AUX1uc
I/Ouc
CAUX1
GND
CCLK
CRST
CVCC
PORADJ
Optional R1/R2 resistor
divider − if not used it is
recommended to connect
PORADJ to Ground
10 mF
INT
PRES
CMDVCC
ORDERING INFORMATION
Device Package Shipping
NCN8025AMNTXG QFN24
(Pb−Free)
3000 / Tape & Reel
NCN8025MTTBG QFN16
(Pb−Free)
3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NCN8025 / NCN8025A
www.onsemi.com
14
PACKAGE DIMENSIONS
QFN24, 4x4, 0.5P
CASE 485L
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
SEATING
PLANE
D
B
0.15 C
A
A3
A
E
PIN 1
REFEENCE
2X
0.15 C
2X
0.08 C
0.10 C
C
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 4.00 BSC
D2 2.70 2.90
E 4.00 BSC
E2 2.70 2.90
e 0.50 BSC
L 0.30 0.50
24X
L
D2
b
1
7
13
19
e/2
E2
e
24
0.10 B
0.05
AC
C
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE TERMINAL
CONSTRUCTIONS
A1
A3
TOP VIEW
SIDE VIEW
DETAIL B
BOTTOM VIEW
DETAIL A
SOLDERING FOOTPRINT
DIMENSIONS: MILLIMETERS
2.90
4.30
4.30
0.50
0.55
0.32
24X
24X
PITCH
1
2.90
RECOMMENDED
NOTE 4
A1
24X
NOTE 3
L1 0.05 0.15
NCN8025 / NCN8025A
www.onsemi.com
15
PACKAGE DIMENSIONS
QFN16, 3x3, 0.5 P
CASE 488AK
ISSUE O
16X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
4
58
12
9
16 13
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. L
max
CONDITION CAN NOT VIOLATE 0.2 MM
SPACING BETWEEN LEAD TIP AND FLAG.
B
A
0.15
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
LOCATION
0.10 C
0.08 C
(A3)
C
16 X
16X
NOTE 5
0.10 C
0.05
C
A B
NOTE 3
K
16X
EXPOSED PAD
DIM MIN MAX
MILLIMETERS
A 0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 1.65 1.85
E 3.00 BSC
E2 1.65 1.85
e 0.50 BSC
K 0.20 −−
L 0.30 0.50
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NCN8025AMNTXG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Interface - Specialized SMART CARD IC
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