OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

74AVC20T245DGV,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28
74AVC20T245 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 7 — 8 March 2012 21 of 27
NXP Semiconductors
74AVC20T245
20-bit dual supply translating transceiver; 3-state
13. Package outline
Fig 12. Package outline SOT364-1 (TSSOP56)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.2
0.1
8
0
o
o
0.1
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
SOT364-1
99-12-27
03-02-19
w M
θ
A
A
1
A
2
D
L
p
Q
detail X
E
Z
e
c
L
X
(A )
3
0.25
128
56 29
y
pin 1 index
b
H
1.05
0.85
0.28
0.17
0.2
0.1
14.1
13.9
6.2
6.0
0.5 1
8.3
7.9
0.50
0.35
0.5
0.1
0.080.25
0.8
0.4
p
E
v M
A
A
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm
SOT364-1
A
max.
1.2
0
2.5
5 mm
scale
MO-153
74AVC20T245 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 7 — 8 March 2012 22 of 27
NXP Semiconductors
74AVC20T245
20-bit dual supply translating transceiver; 3-state
Fig 13. Package outline SOT481-2 (TSSOP56)
UNIT A
1
A
2
A
3
b
p
D
(1)
E
(2)
H
E
L
p
ceL Z
(1)
ywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
1.05
0.80
0.23
0.13
0.20
0.09
11.4
11.2
4.5
4.3
6.6
6.2
0.4
8
0
o
o
0.07 0.080.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT481-2 MO-194 - - -- - -
01-11-24
0.25
0.4
0.1
w M
b
p
e
128
56
29
Z
pin 1 index
θ
A
A
1
A
2
L
p
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 4.4 mm SOT481-2
A
max.
1.2
74AVC20T245 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 7 — 8 March 2012 23 of 27
NXP Semiconductors
74AVC20T245
20-bit dual supply translating transceiver; 3-state
Fig 14. Package outline SOT1134-2 (HXQFN60)
References
Outline
version
European
projection
Issue date
IEC JEDEC JEITA
SOT1134-2 - - -
- - -
- - -
sot1134-2_po
11-08-15
Unit
mm
max
nom
min
0.50 0.08
0.05
0.02
0.28
0.23
0.18
1.95
1.85
1.75
6.1
6.0
5.9
3.95
3.85
3.75
1.0 2.5 4.5
0.195
0.145
0.095
0.1
A
Dimensions
HXQFN60: plastic compatible thermal enhanced extremely thin quad flat package; no leads;
60 terminals; body 4 x 6 x 0.5 mm SOT1134-2
A
1
A
2
0.42
0.40
0.38
bD
4.1
4.0
3.9
D
h
EE
h
0.08 0.1
yy
1
e
0.5
e
1
e
2
e
3
3.0
e
4
eT
0.49
eR
0.5
K
0.25
0.20
0.15
L
0.28
0.23
0.18
L
1
v
0.05
w
0 5 mm
terminal 1
index area
B
A
D
E
C
y
C
y
1
X
detail X
A A
2
A
1
terminal 1
index area
e
2
e
1
eT
eR
eT
eR
e
4
e
3
e
e
1/2 e
1/2 e
AC
B
v
C
w
b
AC
B
v
C
w
D
h
K
L
E
h
L
1
B1
A1
B7
D5 D8
D6 D7
D1 D4
D2 D3
B20 B18
A27
A26
A17
B11
B17
A11
B8 B10
A16
A32
A10
eR
eT
eR
eT
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P28

74AVC20T245DGV,118

Mfr. #:
Buy 74AVC20T245DGV,118
Manufacturer:
NXP Semiconductors
Description:
Bus Transceivers 20-BIT DUAL-SUP XCVR W/CONFIG VOLT 3-S
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet