IRFR5410TRPBF

IRFR5410PbF
IRFU5410PbF
HEXFET
®
Power MOSFET
V
DSS
= -100V
R
DS(on)
= 0.205
I
D
= -13A
12/13/04
Parameter Typ. Max. Units
R
θJC
Junction-to-Case  1.9
R
θJA
Junction-to-Ambient (PCB mount)**  50 °C/W
R
θJA
Junction-to-Ambient  110
Thermal Resistance
D-Pak
T
O-252AA
I-Pak
TO-251AA
l Ultra Low On-Resistance
l P-Channel
l Surface Mount (IRFR5410)
l Straight Lead (IRFU5410)
l Advanced Process Technology
l Fast Switching
l Fully Avalanche Rated
Description
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ -10V -13
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ -10V -8.2 A
I
DM
Pulsed Drain Current -52
P
D
@T
C
= 25°C Power Dissipation 66 W
Linear Derating Factor 0.53 W/°C
V
GS
Gate-to-Source Voltage ± 20 V
E
AS
Single Pulse Avalanche Energy 194 mJ
I
AR
Avalanche Current -8.4 A
E
AR
Repetitive Avalanche Energy 6.3 mJ
dv/dt Peak Diode Recovery dv/dt -5.0 V/ns
T
J
Operating Junction and -55 to + 150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case )
°C
Absolute Maximum Ratings
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
The D-Pak is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU series) is for through-hole mounting
applications. Power dissipation levels up to 1.5 watts are
possible in typical surface mount applications.
S
D
G
PD -95314A
www.irf.com 1
l Lead-Free
IRFR/U5410PbF
2 www.irf.com
Source-Drain Ratings and Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
 
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
 
p-n junction diode.
V
SD
Diode Forward Voltage   -1.6 V T
J
= 25°C, I
S
= -7.8A, V
GS
= 0V
t
rr
Reverse Recovery Time  130 190 ns T
J
= 25°C, I
F
= -8.4A
Q
rr
Reverse Recovery Charge  650 970 nC di/dt = 100A/µs

t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
-13
-52
A
Notes:
** When mounted on 1" square PCB (FR-4 or G-10 Material ) .
For recommended footprint and soldering techniques refer to application note #AN-994
This is applied for I-PAK, L
S
of D-PAK is measured between
lead and center of die contact
Starting T
J
= 25°C, L = 6.4mH
R
G
= 25, I
AS
= -7.8A. (See Figure 12)
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
-7.8A, di/dt 200A/µs, V
DD
V
(BR)DSS
,
T
J
150°C
Pulse width 300µs; duty cycle 2%.
S
D
G
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage -100   V V
GS
= 0V, I
D
= -250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient  -0.12  V/°C Reference to 25°C, I
D
= -1.0mA
R
DS(on)
Static Drain-to-Source On-Resistance   0.205 V
GS
= -10V, I
D
= -7.8A
V
GS(th)
Gate Threshold Voltage -2.0  -4.0 V V
DS
= V
GS
, I
D
= -250µA
g
fs
Forward Transconductance 3.2   S V
DS
= -50V, I
D
= -7.8A
  -25
µA
V
DS
= -100V, V
GS
= 0V
  -250 V
DS
= -80V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage   100 V
GS
= 20V
Gate-to-Source Reverse Leakage   -100
nA
V
GS
= -20V
Q
g
Total Gate Charge   58 I
D
= -8.4A
Q
gs
Gate-to-Source Charge   8.3 nC V
DS
= -80V
Q
gd
Gate-to-Drain ("Miller") Charge   32 V
GS
= -10V, See Fig. 6 and 13 
t
d(on)
Turn-On Delay Time  15  V
DD
= 50V
t
r
Rise Time  58  I
D
= -8.4A
t
d(off)
Turn-Off Delay Time  45  R
G
= 9.1
t
f
Fall Time  46  R
D
=6.2Ω, See Fig. 10 
Between lead,
 
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance  760  V
GS
= 0V
C
oss
Output Capacitance  260  pF V
DS
= -25V
C
rss
Reverse Transfer Capacitance  170   = 1.0MHz, See Fig. 5
nH
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
L
D
Internal Drain Inductance
L
S
Internal Source Inductance  
I
GSS
ns
4.5
7.5
I
DSS
Drain-to-Source Leakage Current
S
D
G
Uses IRF9530N data and test conditions.
IRFR/U5410PbF
www.irf.com 3
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.01
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
-4.5V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-4.5V
0.1
1
10
100
0.1 1 10 100
20µs PULSE WIDTH
T = 150 C
J
°
TOP
BOTTOM
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
-4.5V
-V , Drain-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
DS
D
-4.5V
0.1
1
10
100
4 5 6 7 8 9 10
V = 10V
20µs PULSE WIDTH
DS
-V , Gate-to-Source Voltage (V)
-I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 150 C
J
°
-60 -40 -20 0 20 40 60 80 100 120 140 160
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
-10V
-14A

IRFR5410TRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 1 P-CH -100V HEXFET 26mOhms 70nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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