15
LTC3410-1.875
34101875f
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
SC6 Package
6-Lead Plastic SC70
(Reference LTC DWG # 05-08-1638)
1.15 – 1.35
(NOTE 4)
1.80 – 2.40
0.15 – 0.30
6 PLCS (NOTE 3)
SC6 SC70 1205 REV B
1.80 – 2.20
(NOTE 4)
0.65 BSC
PIN 1
0.80 – 1.00
1.00 MAX
0.00 – 0.10
REF
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. DETAILS OF THE PIN 1 INDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE INDEX AREA
7. EIAJ PACKAGE REFERENCE IS EIAJ SC-70
8. JEDEC PACKAGE REFERENCE IS MO-203 VARIATION AB
2.8 BSC
0.47
MAX
0.65
REF
RECOMMENDED SOLDER PAD LAYOUT
PER IPC CALCULATOR
1.8 REF
1.00 REF
INDEX AREA
(NOTE 6)
0.10 – 0.18
(NOTE 3)
0.26 – 0.46
GAUGE PLANE
0.15 BSC
0.10 – 0.40
