5 GHz to 12 GHz
GaAs, MMIC, Fundamental Mixer
Data Sheet
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2017 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Low conversion loss: 9 dB
No dc bias and no external matching required
Ideal for upconversion and downconversion
Wideband IF range: DC to 4 GHz
Ultrasmall package: 8-Lead MINI_SO_EP
APPLICATIONS
Very small aperture terminals (VSAT) and mobile satellite
communication terminals
Microwave and military radio
Wireless backhaul equipment
Automotive, dedicated short range communications (DSRC)
and intelligent vehicle highway systems (IVHS)
Military radar, electronic warfare (EW), and electronic
counter measure (ECM) subsystems
FUNCTIONAL BLOCK DIAGRAM
1
2
3
4
GND
GND
NIC
LO
8
7
6
5
GND
GND
IF
RF
HMC220B
15769-001
NIC = NOT INTERNAL
LY
CONNECTED
Figure 1.
GENERAL DESCRIPTION
The HMC220B is an ultraminiature, double-balanced mixer in
an 8-lead mini small outline package with exposed pad
(MINI_SO_EP). This fundamental, monolithic microwave
integrated circuit (MMIC) mixer is constructed of gallium
arsenide (GaAs) Schottky diodes and planar transformer baluns
on the chip.
The device can be used as an upconverter, downconverter,
biphase demodulator, or phase comparator from 5 GHz to
12 GHz. The HMC220B provides excellent local oscillator (LO)
to radio frequency (RF) and LO to intermediate frequency (IF)
isolation due to optimized balun structures and operates as low as
7 dBm. The RoHS compliant HMC220B eliminates the need for
wire bonding and is compatible with high volume surface-
mount manufacturing techniques.