LQG18HH6N2S00D

Spec No. JELF243B-9102E-01 P.4 / 9
MURATA MFG.CO., LTD
Reference Only
4.0±0.1
0.1
0
φ
1.
2.0±0.05
3.5±0.05
8.0±0.3
1.75±0.1
4.0±0.1
Direction of Feed
1.1max
1.05±0.1
1.85±0.1
Polarity marking
7. Specification of Packaging
7.1 Appearance and Dimensions of paper tape (8mm-wide)
(in mm)
7.2 Specification of Taping
(1) Packing quantity (standard quantity)
4,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1 % of the number per reel or 1 pc., whichever is greater, and
are not continuous. The Specified quantity per reel is kept.
7.3 Pull Strength
Top tape
5N min.
Bottom tape
7.4 Peeling off force of cover tape
Speed of Peeling off 300mm/min
Peeling off force 0.1N to 0.6N
(minimum value is typical)
7.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
F
165 to 180 degree
Top tape
Bottom tape
Base tape
Empty tape
190 min.
Leader
Trailer
2.0±0.5
13.0±0.2
21.0±0.8
180
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
Spec No. JELF243B-9102E-01 P.5 / 9
MURATA MFG.CO., LTD
Reference Only
7.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2),
Quantity etc ・・・
1) <Expression of Inspection No.>
□□ OOOO 
(1) (2) (3)
(1) Factory Code
(2)
Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS marking> ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
7.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking(2), Quantity, etc ・・・
7.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
8.
!
Caution
8.1 Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.
(1) Aircraft equipment (6) Transportation equipment (trains, ships, etc.)
(2) Aerospace equipment
(7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
8.2 Caution (Rating)
Do not exceed maximum rated current of the product. Thermal stress may be transmitted to the product and
short/open circuit of the product or falling off the product may be occurred.
8.3 Fail-safe
Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may be
caused by the abnormal function or the failure of our product.
W
D
Label
H
Spec No. JELF243B-9102E-01 P.6 / 9
MURATA MFG.CO., LTD
Reference Only
9. Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9.1 Land pattern designing
a 0.6 to 0.8
B 1.8 to 2.2
c 0.6 to 0.8
(in mm)
9.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste : 100μm to 150μm.
9.3 Reflow soldering conditions
Inductance value may be changed a little due to the amount of solder.
So, the chip coil shall be soldered by reflow so that the solder volume can be controlled.
Pre-heating should be in such a way that the temperature difference between solder and product surface
is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the
temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the
deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C, 90s±30s
Heating above 220°C, 30s60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
9.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C, 1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1,-0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
a
b
Chip Coil
Land
Solder Resist
c
Limit Profile
Standard Profile
90s±30s
230℃
260
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.

LQG18HH6N2S00D

Mfr. #:
Manufacturer:
Murata Electronics
Description:
Fixed Inductors 0603 6.2nH +/-0.3nH 100MHz 0.20ohm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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