LQG18HH6N2S00D Datasheet LQG18HH33NJ00D, LQG18HH6N2S00D, LQG18HH2N7S00D | P7-P9

Spec No. JELF243B-9102E-01 P.7 / 9

MURATA MFG.CO., LTD

Reference Only

9.5 Solder Volume

・ Solder shall be used not to be exceeded the upper limits as shown below.

・ Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.

Exceeding solder volume may cause the failure of mechanical or electrical performance.

1/3T≦t≦T

T： thickness of product

9.6 Mount Shock

Over Mechanical stress to products at mounting process causes crack and electrical failure etc.

9.7 Product’s location

The following shall be considered when designing and laying out P.C.B.'s.

(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to

warping the board.

［Products direction］

Products shall be located in the sideways

direction (Length: a＜b) to the mechanical

stress.

(2) Products location on P.C.B. separation

Products (A, B, C, D) shall be located carefully so

that products are not subject to the mechanical

stress due to warping the board.

Because they may be subjected the mechanical

stress in order of A ＞C＞B  D.

9.8 Cleaning Conditions

Products shall be cleaned on the following conditions.

(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)

(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance

phenomenon at the mounted products and P.C.B.

Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.

(3) Cleaner

1. Alcohol type cleaner

Isopropyl alcohol (IPA)

2. Aqueous agent

PINE ALPHA ST-100S

(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,

products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.

(5) Other cleaning Please contact us.

9.9 Resin coating

The inductance value may change and/or it may affect on the product's performance due to high cure-stress

of resin to be used for coating / molding products. So please pay your careful attention when you select

resin.

In prior to use, please make the reliability evaluation with the product mounted in your application set.

Upper Limit

Recommendable

Seam

Slit

Lengh:a<b

〈

Poor example

〉

〈

Good example

〉

Spec No. JELF243B-9102E-01 P.8 / 9

MURATA MFG.CO., LTD

Reference Only

9.10 Handling of a substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting

to the substrate when cropping the substrate, inserting and removing a connector from the substrate or

tightening screw to the substrate.

Excessive mechanical stress may cause cracking in the product.

Bending Twisting

9.11 Storage and Handing Requirements

(1) Storage period

Use the products within 6 months after delivered.

Solderability should be checked if this period is exceeded.

(2) Storage conditions

・Products should be stored in the warehouse on the following conditions.

Temperature ： -10°C to 40°C

Humidity

： 15% to 85% relative humidity No rapid change on temperature and humidity

Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause

oxidization of electrode, resulting in poor solderability.

・Products should be stored on the palette for the prevention of the influence from humidity, dust and

so on.

・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.

・Products should be stored under the airtight packaged condition.

(3) Handling Condition

Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.

10. △

Notes

(1)Please make sure that your product has been evaluated in view of your specifications with our product being

mounted to your product.

(2)You are requested not to use our product deviating from the reference specifications.

(3)The contents of this reference specification are subject to change without advance notice.

Please approve our product specifications or transact the approval sheet for product specifications before

ordering.

Spec No. JELF243B-9102E-01 P.9 / 9

MURATA MFG.CO., LTD

Reference Only

(1) Residual elements and stray elements of test fixture can be described by F-parameter shown in following.

A B V

C D I

(2) The impedance of chip coil Zx and measured value Zm can be described by input/output current/voltage.

， I

(3) Thus,the relation between Zx and Zm is following;

Zm-β where, α= D / A =1

1-ZmΓ β= B / D =Zsm-(1-Yom Zsm)Zss

Γ= C / A =Yom

Zsm:measured impedance of short chip

Zss:residual impedance of short chip (0nH)

Yom:measured admittance when opening the fixture

(4) Lx and Qx shall be calculated with the following equation.

Im(Zx) Im(Zx) Lx : Inductance of chip coil

2πf ， Re(Zx) Qx: Q of chip coil

f : Measuring frequency

Zm=

Zx=

Zx= 

Lx=

Qx=

ProductTest fixtureTest Head

P1-P3 P4-P6 P7-P9

LQG18HH6N2S00D

Mfr. #:

Buy LQG18HH6N2S00D

Manufacturer:

Murata Electronics

Description:

Fixed Inductors 0603 6.2nH +/-0.3nH 100MHz 0.20ohm

Lifecycle:

New from this manufacturer.

Delivery:

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LQG18HH6N2S00D

LQG18HH6N2S00D

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