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EV1HMC553ALC3B

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25
6 GHz to 14 GHz, GaAs, MMIC,
Double-Balanced Mixer
Data Sheet
HMC553ALC3B
Rev. A Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved.
Technical Support www.analog.com
FEATURES
Passive: no dc bias required
Conversion loss: 7 dB typical at 6 GHz to 11 GHz
Input IP3: 18 dBm typical at 6 GHz to 11 GHz
LO to RF isolation: 36 dB typical
Wide IF bandwidth: dc to 5 GHz
RoHS compliant, 12-terminal, 2.90 mm × 2.90 mm LCC package
APPLICATIONS
Microwave and very small aperture terminal (VSAT) radios
Test equipment
Point to point radios
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
FUNCTIONAL BLOCK DIAGRAM
1
GND
7
GND
8
RF
9
GND
10
NIC
11
NIC
12
NIC
4
GND
2
LO
3
GND
5
IF
6
GND
PACKAGE
BASE
GND
HMC553ALC3B
16420-001
Figure 1.
GENERAL DESCRIPTION
The HMC553ALC3B is a general-purpose, double-balanced,
gallium arsenide (GaAs), monolithic microwave integrated
circuit (MMIC) mixer housed in a leadless Pb-free, RoHS
compliant LCC package. The HMC553ALC3B can be used as an
upconverter or downconverter between 6 GHz and 14 GHz.
This mixer requires no external components or matching
circuitry.
The HMC553ALC3B provides local oscillator (LO) to radio
frequency (RF) and LO to intermediate frequency (IF) suppression
due to optimized balun structures. The mixer operates with LO
drive levels from 9 dBm to 15 dBm. The HMC553ALC3B
eliminates the need for wire bonding, allowing use of surface-
mount manufacturing techniques.
HMC553ALC3B Data Sheet
Rev. A | Page 2 of 25
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 1
Revision History ............................................................................... 2
Specifications ..................................................................................... 3
Absolute Maximum Ratings ............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution .................................................................................. 4
Pin Configuration and Function Descriptions ............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
Downconverter Performance ...................................................... 6
Upconverter Performance ......................................................... 14
Isolation and Return Loss ......................................................... 18
IF Bandwidth—Downconverter, Upper Sideband................. 20
IF Bandwidth—Downconverter, Lower Sideband ................. 21
Spurious and Harmonics Performance ................................... 22
Theory of Operation ...................................................................... 23
Applications Information .............................................................. 24
Typical Application Circuit ....................................................... 24
Evaluation PCB Information .................................................... 24
Outline Dimensions ....................................................................... 25
Ordering Guide .......................................................................... 25
REVISION HISTORY
6/2018—Rev.0 to Rev. A
Added 6 GHz to 11 GHz Downconverter Performance, Noise
Figure Parameter and 11 GHz to 14 GHz Downconverter
Performance, Noise Figure Parameter, Table 1 ............................. 3
2/2018—Revision 0: Initial Versi on
Data Sheet HMC553ALC3B
Rev. A | Page 3 of 25
SPECIFICATIONS
T
A
= 25°C, IF = 100 MHz, RF = −10 dBm, LO = 13 dBm, upper side band. All measurements performed as a downconverter, unless
otherwise noted, on the evaluation printed circuit board (PCB).
Table 1.
Parameter Symbol Test Conditions/Comments Min Typ Max Unit
FREQUENCY RANGE
RF 6 14 GHz
LO Input 6 14 GHz
IF DC 5 GHz
LO DRIVE LEVELS 9 13 15 dBm
6 GHz to 11 GHz PERFORMANCE
Downconverter
Conversion Loss 7 9 dB
Noise Figure 8.5 dB
Input Third-Order Intercept IP3 15 18 dBm
Input 1 dB Compression Point P1dB 9.5 dBm
Input Second-Order Intercept IP2 40 dBm
Upconverter IF
IN
Conversion Loss 7 dB
Input Third-Order Intercept IP3 19 dBm
Input 1 dB Compression Point P1dB 8 dBm
Isolation
RF to IF 18 32 dB
LO to RF 30 36 dB
LO to IF 28 32 dB
11 GHz to 14 GHz PERFORMANCE
Downconverter
Conversion Loss 9 10 dB
Noise Figure 10 dB
Input Third-Order Intercept IP3 18 22 dBm
Input 1 dB Compression Point P1dB 11.5 dBm
Input Second-Order Intercept IP2 45 dBm
Upconverter IF
IN
Conversion Loss 8 dB
Input Third-Order Intercept IP3 19 dBm
Input 1 dB Compression Point P1dB 8 dBm
Isolation
RF to IF 25 29 dB
LO to RF 30 37 dB
LO to IF 28 33 dB
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P25

EV1HMC553ALC3B

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RF Development Tools EVALUATION PCB ASSY
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