Data Sheet HMC553ALC3B
Rev. A | Page 25 of 25
OUTLINE DIMENSIONS
03-02-2017-A
PKG-004837
0.50
BSC
0.32
BSC
BOT
TOM VIEW
TOP VIEW
SIDE VIEW
0.08
BSC
1
4
6
7
9
10
12
3
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.36
0.30
0.24
PIN 1
EXPOSED
PAD
PIN 1
INDICATOR
3.05
2.90 SQ
2.75
2.10 BSC
1.00 REF
1.60
1.50 SQ
1.40
0.90
0.80
0.70
SEA
TING
PLANE
Figure 84. 12-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-12-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Moisture Sensitivity Level (MSL) Rating
2
Package Description Package Option
HMC553ALC3BTR −40°C to +85°C MSL3 12-Terminal Ceramic LCC E-12-4
HMC553ALC3BTR-R5 −40°C to +85°C MSL3 12-Terminal Ceramic LCC E-12-4
EV1HMC553ALC3B Evaluation PCB Assembly
1
All models are RoHS compliant.
2
The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
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D16420-0-6/18(A)
