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Rev. Date: 3 February 2012 / Ver. 1.01
Translucent Epoxy
Encapsulating & Potting Compound
832C Technical Data Sheet
Compatibility
Adhesion—As seen in the substrate adhesion table, the 832C epoxy adheres to most materials found on
printed circuit assemblies; however, it is not compatible with contaminants like water, oil, and greasy flux
residues that may affect adhesion. If contamination is present, clean the printed circuit assembly with
electronic cleaner such as MG Chemicals 4050 Safety Wash, 406B Superwash, or 824 Isopropyl Alcohol.
Substrate Adhesion in Decreasing Order
a) Does not bond to polypropylene
Chemical Resistance—The chemical solvent resistance table presents the percent weight change over
the indicated period. The results show low water absorption and a high chemical resistance to water and
most ionic species. Softening and swelling occurs for aggressive organic solvents.
Chemical Solvent Resistance
Storage
Store between 16 and 27 °C [60 and 80 °F] in dry area away from sunlight. Prolonged storage or storage
at or near freezing temperatures can result in crystallization. If crystallization occurs, reconstitute the
component to its original state by temporarily warming it to 50 to 60 °C [122 to 140 °F]. To ensure full
homogeneity, stir thoroughly the warm component, reincorporating all settled material. Re-secure
container lid and let cool down before use.
