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Rev. Date: 3 February 2012 / Ver. 1.01
Translucent Epoxy
Encapsulating & Potting Compound
832C Technical Data Sheet
To heat cure the 832C epoxy
Put in oven at 65 °C [149 °F] for 60 minutes.
–OR–
Put in oven at 80 °C [176 °F] for 45 minutes.
–OR–
Put in oven at 100 °C [212 °F] for 35 minutes.
ATTENTION!
Due to exothermic reaction, heat cure temperatures should be at least 25% below the maximum
temperature tolerated by the most fragile PCB component. For larger potting blocks, reduce heat cure
temperature by greater margins.
Packaging and Supporting Products
Product Availability
Supporting Products
8328 Epoxy and Adhesive Cleaner
8329 Epoxy Mold Release (for temperature cures ≤85 °C)
Technical Support
Contact us regarding any questions, improvement suggestions, or problems with this product. Application
notes, instructions, and FAQs are located at www.mgchemicals.com.
Email: support@mgchemicals.com
Phone: 1-800-201-8822 Ext. 128 (Canada, Mexico & USA)
1-604-888-3084 Ext. 128 (International)
Fax: 1-604-888-7754 or 1-800-708-9888
Mailing address: Manufacturing & Support Head Office
1210 Corporate Drive 9347–193rd Street
Burlington, Ontario, Canada Surrey, British Columbia, Canada
L7L 5R6 V4N 4E7
Disclaimer
This information is believed to be accurate. It is intended for professional end users having the skills to
evaluate and use the data properly. M.G. Chemicals Ltd. does not guarantee the accuracy of the data and
assumes no liability in connection with damages incurred while using it.
