STPS2L30 Characteristics
5/10
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30
I (mA)
R
V (V)
R
T =125°C
j
T =150°C
j
T =100°C
j
T =25°C
j
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
Figure 15. Forward voltage drop versus
forward current (high level)
Figure 16. Forward voltage drop versus
forward current ( low level)
I (A)
FM
0.1
1.0
10.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
T
j
=25 °C
(maximum values)
T
j
=125 °C
(maximum values)
T
j
=125 °C
(maximum values)
T
j
=125 °C
(typical values)
V (V)
FM
I (A)
FM
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
T
j
=25 °C
(maximum values)
T
j
=125 °C
(maximum values)
T
j
=125 °C
(maximum values)
T
j
=125 °C
(typical values)
V (V)
FM
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA, SMB flat)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, copper
thickness = 35 µm) (SMA flat)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (Cm²)
CU
SMB flat)
SMA
R (°C/W)
th(j-a)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMA-Flat
S (Cm²)
CU
