TSSOP8
CASE 948S01
ISSUE C
DATE 20 JUN 2008
GENERIC
MARKING DIAGRAM*
XXX
YWW
A G
G
*This information is generic. Please refer to
device data sheet for actual part marking.
PbFree indicator, “G” or microdot “ G”,
may or may not be present.
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 2.90 3.10 0.114 0.122
B 4.30 4.50 0.169 0.177
C --- 1.10 --- 0.043
D 0.05 0.15 0.002 0.006
F 0.50 0.70 0.020 0.028
G 0.65 BSC 0.026 BSC
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
6. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE -W-.
____
SEATING
PLANE
PIN 1
1
4
85
DETAIL E
B
C
D
A
G
L
2X L/2
U
S
U0.20 (0.008) T
S
U
M
0.10 (0.004) V
S
T
0.076 (0.003)
T
V
W
8x REFK
SCALE 2:1
IDENT
K 0.19 0.30 0.007 0.012
S
U0.20 (0.008) T
DETAIL E
F
M
0.25 (0.010)
K1
K
JJ1
SECTION NN
J 0.09 0.20 0.004 0.008
K1 0.19 0.25 0.007 0.010
J1 0.09 0.16 0.004 0.006
N
N
XXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = PbFree Package
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON00697D
ON SEMICONDUCTOR STANDARD
TSSOP8
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
DOCUMENT NUMBER:
98AON00697D
PAGE 2 OF 2
ISSUE REVISION DATE
O RELEASED FOR PRODUCTION. 18 APR 2000
A ADDED MARKING DIAGRAM INFORMATION. REQ. BY V. BASS. 13 JAN 2006
B CORRECTED MARKING DIAGRAM PIN 1 LOCATION AND MARKING. REQ. BY C.
REBELLO.
13 MAR 2006
C REMOVED EXPOSED PAD VIEW AND DIMENSIONS P AND P1. CORRECTED
MARKING INFORMATION. REQ. BY C. REBELLO.
20 JUN 2008
© Semiconductor Components Industries, LLC, 2008
June, 2008 Rev. 01C
Case Outline Number:
948S
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