MT18VDVF12872Y-335D4

PDF: 09005aef81c7380b/Source: 09005aef81c7380e Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF18C_128x72.fm - Rev. C 11/07 EN
7 ©2005 Micron Technology, Inc. All rights reserved
1GB (x72, ECC, SR): 184-Pin DDR VLP RDIMM
Electrical Specifications
Electrical Specifications
Stresses greater than those listed in Table 6 may cause permanent damage to the
module. This is a stress rating only, and functional operation of the module at these or
any other conditions outside those indicated on the device data sheet is not implied.
Exposure to absolute maximum rating conditions for extended periods may adversely
affect reliability.
Notes: 1. For further information, refer to technical note TN-00-08: “Thermal Applications,” available
on Micron’s Web site.
Input Capacitance
Micron encourages designers to simulate the performance of the module to achieve
optimum values. Simulations are significantly more accurate and realistic than a gross
estimation of module capacitance when inductance and delay parameters associated
with trace lengths are used in simulations. JEDEC modules are currently designed using
simulations to close timing budgets.
Component AC Timing and Operating Conditions
Recommended AC operating conditions are given in the DDR component data sheets.
Component specifications are available on Microns Web site. Module speed grades
correlate with component speed grades, as shown in Table 7.
Table 6: Absolute Maximum Ratings
Symbol Parameter Min Max Units
V
DD/VDDQVDD/VDDQ supply voltage relative to VSS –1.0 +3.6 V
VIN, VOUT Voltage on any pin relative to VSS –0.5 +3.2 V
I
I Input leakage current; Any input 0V VIN VDD;
VREF input 0V VIN 1.35V (All other pins not under
test = 0V)
Address inputs,
RAS#, CAS#, WE#, BA,
S#, CKE
–5 +5 µA
CK, CK0 –10 +10
I
OZ Output leakage current; 0V VOUT VDDQ; DQ are
disabled
DQ, DQS –5 +5 µA
T
A
DRAM ambient operating temperature
1
Commercial 0 +70 °C
Industrial –40 +85 °C
Table 7: Module and Component Speed Grades
Module Speed Grade Component Speed Grade
-40B -5B
-335 -6
PDF: 09005aef81c7380b/Source: 09005aef81c7380e Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF18C_128x72.fm - Rev. C 11/07 EN
8 ©2005 Micron Technology, Inc. All rights reserved
1GB (x72, ECC, SR): 184-Pin DDR VLP RDIMM
Electrical Specifications
IDD Specifications
Table 8: I
DD Specifications and Conditions – 1GB
Values are shown for the MT46V128M4 DDR SDRAM only and are computed from values specified in the
512Mb (128 Meg x 4) component data sheet
Parameter/Condition Symbol -40B -335 Units
Operating one bank active-precharge current:
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN);
DQ and DQS inputs changing once per clock cycle; Address and control inputs changing
once every two clock cycles
IDD0 2,790 2,340 mA
Operating one bank active-read-precharge current: BL = 2;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); IOUT = 0mA; Address and control inputs changing once per clock cycle
IDD1 3,330 2,880 mA
Precharge power-down standby current: All device banks idle; Power-down mode;
t
CK =
t
CK (MIN); CKE = LOW
IDD2P 90 90 mA
Idle standby current: CS# = HIGH; All device banks idle;
t
CK =
t
CK (MIN); CKE = HIGH;
Address and other control inputs
changing once per clock cycle; V
IN
=V
REF
for DQ and
DQS
IDD2F 990 810 mA
Active power-down standby current: One device bank active; Power-down mode;
t
CK =
t
CK (MIN); CKE = LOW
I
DD3P 810 630 mA
Active standby current: CS# = HIGH; CKE = HIGH; One device bank active;
t
RC =
t
RAS (MAX);
t
CK =
t
CK (MIN); DQ and DQS inputs changing twice per clock cycle;
Address and other control inputs changing once per clock cycle
IDD3N 1,080 900 mA
Operating burst READ current: BL = 2; Continuous burst READs; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN);
I
OUT =0mA
I
DD4R 3,420 2,970 mA
Operating burst WRITE current: BL = 2; Continuous burst WRITEs; One device bank
active; Address and control inputs changing once per clock cycle;
t
CK =
t
CK (MIN); DQ
and DQS inputs changing twice per clock cycle
IDD4W 3,510 3,150 mA
Auto refresh current
t
REFC =
t
RFC (MIN) IDD5 6,210 5,220 mA
t
REFC = 7.8125µs IDD5A 198 180 mA
Self refresh current: CKE 0.2V IDD69090mA
Operating bank interleave READ current: Four device bank interleaving READs
(BL = 4) with auto precharge;
t
RC =
t
RC (MIN);
t
CK =
t
CK (MIN); Address and control
inputs change only during active READ or WRITE commands
I
DD7 8,100 7,290 mA
PDF: 09005aef81c7380b/Source: 09005aef81c7380e Micron Technology, Inc., reserves the right to change products or specifications without notice.
DVF18C_128x72.fm - Rev. C 11/07 EN
9 ©2005 Micron Technology, Inc. All rights reserved
1GB (x72, ECC, SR): 184-Pin DDR VLP RDIMM
Register and PLL Specifications
Register and PLL Specifications
Notes: 1. Timing and switching specifications for the register listed above are critical for proper oper-
ation of the DDR SDRAM RDIMM. These are meant to be a subset of the parameters for the
specific device used on the module. Detailed information for this register is available in
JEDEC standard JESD82.
Table 9: Register Specifications
SSTV16859 devices or equivalent JESD82-4B
Parameter Symbol Pins Condition Min Max Units
DC high-level
input voltage
VIH(DC) Address, control,
command
SSTL_25 VREF(DC) + 150 mV
DC low-level
input voltage
V
IL(DC) Address, control,
command
SSTL_25 VREF(DC) - 150 mV
AC high-level
input voltage
VIH(AC) Address, control,
command
SSTL_25 VREF(DC) + 310 VDD mV
AC low-level
input voltage
VIL(AC) Address, control,
command
SSTL_25 VREF(DC) - 310 mV
Output high voltage V
OH Parity output LVCMOS VDD - 0.2 V
Output low voltage VOL Parity output LVCMOS 0.2 V
Input current I
I All pins VI = VDDQ or VSSQ–5.0 +5.0µA
Static standby I
DD All pins RESET# = VSSQ (IO = 0) 100 µA
Static operating IDD All pins RESET# = VSSQ;
VI = VIH(AC) or VIL(DC)
IO = 0
–Varies by
manufacturer
mA
Dynamic operating
(clock tree)
IDDD n/a RESET# = VDD, VI = VIH(AC)
or VIL(AC), IO = 0; CK and
CK# switching 50 percent
duty cycle
–Varies by
manufacturer
µA
Dynamic operating
(per each input)
IDDD n/a RESET# = VDD, VI = VIH(AC)
or VIL(AC), IO = 0; CK and
CK# switching 50 percent
duty cycle; One data input
switching at
t
CK/2, 50
percent duty cycle
–Varies by
manufacturer
µA
Input capacitance
(per device, per pin)
C
I All inputs except
RESET#
VI = VREF ±250mV;
V
DDQ = 1.8V
2.5 3.5 pF
Input capacitance
(per device, per pin)
C
I RESET# VI = VDDQ or VSSQ–Varies by
manufacturer
pF

MT18VDVF12872Y-335D4

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR SDRAM 1GB 184RDIMM
Lifecycle:
New from this manufacturer.
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