LTC3872-1
13
38721f
For more information www.linear.com/LTC3872-1
Input Capacitor Selection
The input capacitor of a boost converter is less critical
than the output capacitor, due to the fact that the inductor
is in series with the input and the input current waveform
is continuous (see Figure 6b). The input voltage source
impedance determines the size of the input capacitor,
which is typically in the range of 10µF to 100µF. A low ESR
capacitor is recommended, although it is not as critical as
for the output capacitor.
The RMS input capacitor ripple current for a boost con-
verter is:
I
RMS(CIN)
= 0.3
V
IN(MIN)
L f
D
MAX
Please note that the input capacitor can see a very high
surge current when a battery is suddenly connected to
the input of the converter and solid tantalum capacitors
can fail catastrophically under these conditions. Be sure
to specify surge-tested capacitors!
Efficiency Considerations: How Much Does VDS
Sensing Help?
The efficiency of a switching regulator is equal to the output
power divided by the input power (×100%).
Percent efficiency can be expressed as:
% Efficiency = 100% – (L1 + L2 + L3 + …),
where L1, L2, etc. are the individual loss components as a
percentage of the input power. It is often useful to analyze
individual losses to determine what is limiting the efficiency
and which change would produce the most improvement.
Although all dissipative elements in the circuit produce
losses, four main sources usually account for the majority
of the losses in LTC3872-1 application circuits:
1. The supply current into V
IN
. The V
IN
current is the
sum of the DC supply current I
Q
(given in the Electrical
Characteristics) and the MOSFET driver and control cur-
rents. The DC supply current into the V
IN
pin is typically
about 250µA and represents a small power loss (much
less than 1%) that increases with V
IN
. The driver current
results from switching the gate capacitance of the power
MOSFET; this current is typically much larger than the DC
current. Each time the MOSFET is switched on and then
off, a packet of gate charge Q
G
is transferred from V
IN
to ground. The resulting dQ/dt is a current that must be
supplied to the Input capacitor by an external supply. If
the IC is operating in CCM:
I
Q(TOT)
≈ I
Q
= f • Q
G
P
IC
= V
IN
• (I
Q
+ f • Q
G
)
2. Power MOSFET switching and conduction losses. The
technique of using the voltage drop across the power
MOSFET to close the current feedback loop was chosen
because of the increased efficiency that results from not
having a sense resistor. The losses in the power MOSFET
are equal to:
P
FET
=
I
O(MAX)
1 D
MAX
2
R
DS(ON)
D
MAX
ρ
T
+ k V
O
1.85
I
O(MAX)
1 D
MAX
C
RSS
f
The I
2
R power savings that result from not having a discrete
sense resistor can be calculated almost by inspection.
P
R(SENSE)
=
I
O(MAX)
1 D
MAX
2
R
SENSE
D
MAX
To understand the magnitude of the improvement with
this V
DS
sensing technique, consider the 3.3V input, 5V
output power supply shown in the Typical Application on
the front page. The maximum load current is 7A (10A peak)
and the duty cycle is 39%. Assuming a ripple current of
40%, the peak inductor current is 13.8A and the average
applicaTions inForMaTion
Figure 7. Load Transient Response for a 3.3V Input,
5V Output Boost Converter Application, 0.1A to 1A Step
I
LOAD
500mA/DIV
V
OUT
200mV/DIV
AC-COUPLED
20µs/DIV
38721 F07
LTC3872-1
14
38721f
For more information www.linear.com/LTC3872-1
is 11.5A. With a maximum sense voltage of about 140mV,
the sense resistor value would be 10mΩ, and the power
dissipated in this resistor would be 514mW at maximum
output current. Assuming an efficiency of 90%, this
sense resistor power dissipation represents 1.3% of the
overall input power. In other words, for this application,
the use of V
DS
sensing would increase the efficiency by
approximately 1.3%.
For more details regarding the various terms in these
equations, please refer to the section Boost Converter:
Power MOSFET Selection.
3. The losses in the inductor are simply the DC input cur
-
rent squared times the winding resistance. Expressing this
loss as a function of the output current yields:
P
R(WINDING)
=
I
O(MAX)
1 D
MAX
2
R
W
4. Losses in the boost diode. The power dissipation in the
boost diode is:
P
DIODE
= I
O(MAX)
• V
D
The boost diode can be a major source of power loss in
a boost converter. For the 3.3V input, 5V output at 7A ex-
ample given above, a Schottky diode with a 0.4V forward
voltage
would dissipate 2.8W
, which represents 7% of the
input power. Diode losses can become significant at low
output voltages where the forward voltage is a significant
percentage of the output voltage.
5. Other losses, including C
IN
and C
O
ESR dissipation and
inductor core losses, generally account for less than 2%
of the total additional loss.
Checking Transient Response
The regulator loop response can be verified by looking at
the load transient response. Switching regulators generally
take several cycles to respond to an instantaneous step
in resistive load current. When the load step occurs, V
O
immediately shifts by an amount equal to (DI
LOAD
)(ESR),
and then C
O
begins to charge or discharge (depending on
the direction of the load step) as shown in Figure 7. The
regulator feedback loop acts on the resulting error amp
output signal to return V
O
to its steady-state value. During
this recovery time, V
O
can be monitored for overshoot or
ringing that would indicate a stability problem.
A second, more severe transient can occur when con
-
necting loads with large (>1µF) supply bypass capacitors.
The discharged bypass capacitors are effectively put in
parallel with C
O
, causing a nearly instantaneous drop in
V
O
. No regulator can deliver enough current to prevent
this problem if the load switch resistance is low and it is
driven quickly. The only solution is to limit the rise time
of the switch drive in order to limit the inrush current
di/dt to the load.
Boost Converter Design Example
The design example given here will be for the circuit shown
on the front
page. The input voltage is 3.3V, and the output
is 5V at a maximum load current of 2A.
1. The duty cycle is:
D =
V
O
+ V
D
V
IN
V
O
+ V
D
=
5+ 0.4 3.3
5+ 0.4
= 38.9%
2. An inductor ripple current of 40% of the maximum load
current is chosen, so the peak input current (which is also
the minimum saturation current) is:
I
IN(PEAK)
= 1+
χ
2
I
O(MAX)
1 D
MAX
= 1.2
2
1 0.39
= 3.9A
The inductor ripple current is:
∆I
L
=
c
I
O(MAX)
1–D
MAX
= 0.4
2
1–0.39
=1.3A
And so the inductor value is:
L =
V
IN(MIN)
∆I
L
f
D
MAX
=
3.3V
1.3A 550kHz
0.39 =1.8µH
The component chosen is a 2.2µH inductor made by
Sumida (part number CEP125-H 1ROMH).
applicaTions inForMaTion
LTC3872-1
15
38721f
For more information www.linear.com/LTC3872-1
3. Assuming a MOSFET junction temperature of 125°C,
the room temperature MOSFET R
DS(ON)
should be less
than:
R
DS(ON)
V
ENSS E(MAX)
1–D
MAX
1+
χ
2
I
O(MAX)
ρ
T
= 0.175V
1–0.39
1+
0.4
2
2A 1.5
30m
The MOSFET used was the Si3460 DDV, which has a maxi-
mum R
DS(ON)
of 27mΩ at 4.5V V
GS
, a BV
DSS
of greater
than 30V, and a gate charge of 13.5nC at 4.5V V
GS
.
4. The diode for this design must handle a maximum DC
output current of 2A and be rated for a minimum reverse
voltage of V
OUT
, or 5V. A 25A, 15V diode from On Semi-
conductor (MBRB2515L) was chosen for its high power
dissipation capability.
5.
The output capacitor usually consists of a lower valued,
low ESR ceramic.
6. The choice of an input capacitor for a boost converter
depends on the impedance of the source supply and the
amount of input ripple the converter will safely tolerate.
For this particular design two 22µF Taiyo Yuden ceramic
capacitors (JMK325BJ226MM) are required (the input
and return lead lengths are kept to a few inches). As
with the output node, check the input ripple with a single
oscilloscope probe connected across the input capacitor
terminals.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of
the LTC3872-1. These items are illustrated graphically
in the layout diagram in Figure 8. Check the following in
your layout:
1. The Schottky diode should be closely connected between
the output capacitor and the drain of the external MOSFET.
2. The input decoupling capacitor (0.1µF) should be con
-
nected closely between V
IN
and GND.
3. The trace from SW to the switch point should be kept
short.
4. Keep the switching node NGATE away from sensitive
small signal nodes.
5. The V
FB
pin should connect directly to the feedback
resistors. The resistive divider R1 and R2 must be con-
nected between the (+) plate of C
OUT
and signal ground.
Figure 8. LTC3872-1 Layout Diagram (See PC Board Layout Checklist)
IPRG
I
TH
V
FB
GND
SW
RUN/SS
V
IN
NGATE
LTC3872-1
38721 F08
R1
R2
R
ITH
C
IN
C
OUT
V
OUT
V
IN
C
ITH
+ +
D1
M1L1
BOLD LINES INDICATE HIGH CURRENT PATHS
applicaTions inForMaTion

LTC3872IDDB-1#TRMPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators No RSENSE C Mode Boost DC/DC Cntr
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union