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FGH30N6S2

P1-P3P4-P6P7-P9P10-P12
©2001 Fairchild Semiconductor Corporation FGH30N6S2D / FGP30N6S2D / FGB30NS2D Rev. A
FGH30N6S2D / FGP30N6S2D / FGB30N6S2D
TO-220AB
3 LEAD JEDEC TO-220AB PLASTIC PACKAGE
E
ØP
Q
D
H
1
E
1
L
L
1
60
o
b
1
b
123
e
e
1
A
c
J
1
45
o
D
1
A
1
TERM. 4
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.170 0.180 4.32 4.57 -
A
1
0.048 0.052 1.22 1.32 -
b 0.030 0.034 0.77 0.86 3, 4
b
1
0.045 0.055 1.15 1.39 2, 3
c 0.014 0.019 0.36 0.48 2, 3, 4
D 0.590 0.610 14.99 15.49 -
D
1
-0.160-4.06-
E 0.395 0.410 10.04 10.41 -
E
1
-0.030-0.76-
e 0.100 TYP 2.54 TYP 5
e
1
0.200 BSC 5.08 BSC 5
H
1
0.235 0.255 5.97 6.47 -
J
1
0.100 0.110 2.54 2.79 6
L 0.530 0.550 13.47 13.97 -
L
1
0.130 0.150 3.31 3.81 2
ØP 0.149 0.153 3.79 3.88 -
Q 0.102 0.112 2.60 2.84 -
NOTES:
1. These dimensions are within allowable dimensions of Rev. J of JEDEC TO-
220AB outline dated 3-24-87.
2. Lead dimension and finish uncontrolled in L
1
.
3. Lead dimension (without solder).
4. Add typically 0.002 inches (0.05mm) for solder coating.
5. Position of lead to be measured 0.250 inches (6.35mm) from bottom of dimen-
sion D.
6. Position of lead to be measured 0.100 inches (2.54mm) from bottom of dimen-
sion D.
7. Controlling dimension: Inch.
8. Revision 2 dated 7-97.
©2001 Fairchild Semiconductor Corporation FGH30N6S2D / FGP30N6S2D / FGB30NS2D Rev. A
FGH30N6S2D / FGP30N6S2D / FGB30N6S2D
TO-263AB SURFACE MOUNT JEDEC TO-263AB PLASTIC PACKAGE
TO263AB
24mm TAPE AND REEL
MINIMUM PAD SIZE RECOMMENDED FOR
SURFACE-MOUNTED APPLICATIONS
E
A
1
A
H
1
D
L
b
e
e1
L
2
b
1
L
1
c
TERM. 4
13
13
L
3
b
2
TERM. 4
0.450
0.350
0.150
(3.81)
0.080 TYP (2.03)
0.700
(11.43)
(8.89)
(17.78)
0.062 TYP (1.58)
J
1
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.170 0.180 4.32 4.57 -
A
1
0.048 0.052 1.22 1.32 4, 5
b 0.030 0.034 0.77 0.86 4, 5
b
1
0.045 0.055 1.15 1.39 4, 5
b
2
0.310 - 7.88 - 2
c 0.018 0.022 0.46 0.55 4, 5
D 0.405 0.425 10.29 10.79 -
E 0.395 0.405 10.04 10.28 -
e 0.100 TYP 2.54 TYP 7
e
1
0.200 BSC 5.08 BSC 7
H
1
0.045 0.055 1.15 1.39 -
J
1
0.095 0.105 2.42 2.66 -
L 0.175 0.195 4.45 4.95 -
L
1
0.090 0.110 2.29 2.79 4, 6
L
2
0.050 0.070 1.27 1.77 3
L
3
0.315 - 8.01 - 2
NOTES:
1. These dimensions are within allowable dimensions of Rev.
C of JEDEC TO-263AB outline dated 2-92.
2. L
3
and b
2
dimensions established a minimum mounting
surface for terminal 4.
3. Solder finish uncontrolled in this area.
4. Dimension (without solder).
5. Add typically 0.002 inches (0.05mm) for solder plating.
6. L
1
is the terminal length for soldering.
7. Position of lead to be measured 0.120 inches (3.05mm) from
bottom of dimension D.
8. Controlling dimension: Inch.
9. Revision 10 dated 5-99.
2.0mm
4.0mm
1.75mm
1.5mm
DIA. HOLE
C
L
USER DIRECTION OF FEED
16mm
24mm
COVER TAPE
330mm 100mm
13mm
30.4mm
24.4mm
GENERAL INFORMATION
1. 800 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
ACCESS HOLE
40mm MIN.
Rev. H3
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
Bottomless™
CoolFET™
CROSSVOLT™
DenseTrench™
DOME™
EcoSPARK™
E
2
CMOS™
Ensigna™
FACT™
FACT Quiet Series™
FAST
®
FASTr™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
LittleFET™
MicroFET™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Power247™
PowerTrench
®
QFET™
QS™
QT Optpelectronics™
Quiet Series™
SILENT SWITCHER
®
SMART START™
STAR*POWER™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic™
TruTranslation™
UHC™
UltraFET
®
VCX™
STAR*POWER is used under license
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or
In Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
©2001 Fairchild Semiconductor Corporation
P1-P3P4-P6P7-P9P10-P12

FGH30N6S2

Mfr. #:
Buy FGH30N6S2
Manufacturer:
ON Semiconductor / Fairchild
Description:
IGBT Transistors Sgl N-Ch 600V SMPS
Lifecycle:
New from this manufacturer.
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