MAX5181/MAX5184
10-Bit, 40MHz, Current/Voltage-Output DACs
______________________________________________________________________________________ 13
Figure 7. Using the MAX5181/MAX5184 for I/Q Signal Reconstruction
BP
FILTER
DV
DD
AV
DD
CARRIER
FREQUENCY
MAX2452
IF
10
Q COMPONENT
BP
FILTER
DV
DD
AV
DD
+3V
10
DIGITAL
SIGNAL
PROCESSOR
QUADRATURE
MODULATOR
I COMPONENT
0°
90°
Σ
+3V
MAX5181
MAX5184
MAX5181
MAX5184
400Ω*
400Ω*
REN AGNDDGND
+5V
-5V
402Ω
402Ω
402Ω
402Ω
OUTP
CLK
OUTN
0.1μF
DV
DD
AV
DD
AV
DD
R
SET
**
OUTPUT
*400Ω RESISTORS INTERNAL TO MAX5184 ONLY.**MAX5181 ONLY
MAX5181
MAX5184
10μF
+3V
+
+
+3V
0.1μF
0.1μF
0.1μF
REFR
REFO
CREF
D0–D9
10μF
MAX4108
Figure 6. Differential to Single-Ended Conversion Using a Low-Distortion Amplifier
MAX5181/MAX5184
10-Bit, 40MHz, Current/Voltage-Output DACs
14 ______________________________________________________________________________________
ture stability, wide-band tuning, and past phase-contin-
uos frequency switching, the user may approach a
direct digital synthesis (DDS) AWG (Figure 8b). This
DDS loop supports standard waveforms that are repeti-
tive, such as sine, square, TTL, and triangular wave-
forms. DDS allows for precise control of the
data-stream input to the DAC. Data for one complete
output waveform cycle is sequentially stored in a RAM.
As the RAM addresses are changing, the DAC con-
verts the incoming data bits into a corresponding volt-
age waveform. The resulting output signal frequency is
proportional to the frequency rate at which the RAM
addresses are changed.
Grounding and Power-Supply Decoupling
Grounding and power-supply decoupling strongly influ-
ence the MAX5181/MAX5184’s performance. Unwanted
digital crosstalk may couple through the input, refer-
ence, power-supply, and ground connections, which
may affect dynamic specifications like SNR or SFDR. In
addition, electromagnetic interference (EMI) can either
couple into or be generated by the MAX5181/
MAX5184. Therefore, grounding and power-supply
decoupling guidelines for high-speed, high-frequency
applications should be closely followed.
First, a multilayer PC board with separate ground and
power-supply planes is recommended. High-speed
signals should be run on controlled impedance lines
Figure 8b. Direct Digital Synthesis AWG
Figure 8a. Traditional Arbitrary Waveform Generation
9.6kΩ*
400Ω*
WAVEFORM
MEMORY
(RAM)
DV
DD
AV
DD
*MAX5181 ONLY
MAX5181
MAX5184
10ADR
FILTERED
WAVEFORM
(ANALOG OUTPUT)
LOWPASS
RECONSTRUCTION
FILTER
VARIABLE
fc
COUNTER
CLOCK
GENERATOR
DATA
9.6k
Ω
*
400
Ω
*
WAVEFORM
MEMORY
(RAM)
DV
DD
AV
DD
*MAX5181 ONLY
MAX5181
MAX5184
10
DATA
ADR
A
D
D
E
R
FILTERED
WAVEFORM
(ANALOG OUTPUT)
LOWPASS
RECONSTRUCTION
FILTER
VARIABLE
fc
PHASE
ACCUMULATOR
ACCUMULATOR
FEEDBACK LOOP
FOR DATA BITS
CLOCK
GENERATOR
PIR
PHASE
INCREMENT
REGISTER
MAX5181/MAX5184
10-Bit, 40MHz, Current/Voltage-Output DACs
______________________________________________________________________________________ 15
directly above the ground plane. Since the MAX5181/
MAX5184 have separate analog and digital ground
buses (AGND and DGND, respectively), the PC board
should also have separate analog and digital ground
sections with only one point connecting the two. Digital
signals should run above the digital ground plane, and
analog signals should run above the analog ground
plane.
Both devices have two power-supply inputs: analog
V
DD
(AV
DD
) and digital V
DD
(DV
DD
). Each AV
DD
input
should be decoupled with parallel 10µF and 0.1µF
ceramic-chip capacitors. These capacitors should be
as close to the pin as possible, and their opposite ends
should be as close as possible to the ground plane.
The DV
DD
pins should also have separate 10µF and
0.1µF capacitors adjacent to their respective pins. Try
to minimize analog load capacitance for proper opera-
tion. For best performance, bypass with low-ESR 0.1µF
capacitors to AV
DD
.
The power-supply voltages should also be decoupled
with large tantalum or electrolytic capacitors at the
point they enter the PC board. Ferrite beads with addi-
tional decoupling capacitors forming a pi network can
also improve performance.
24
23
22
21
20
19
OUTN
OUTP
CREF
REFO
REFR
DGND
7
8
9
10
11
12
REN
D0
D1
D2
D3
D4
13
14
15
16
17
18
D5
D6
D7
D8
D9
DV
DD
6
EP
5
4
3
2
1
+
CLK
CS
PD
DACEN
AV
DD
AGND
MAX5184
TQFN-EP
TOP VIEW
Pin Configurations (continued)
Chip Information
SUBSTRATE CONNECTED TO AGND
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages
. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO
24 QSOP E24+1
21-0055
90-0172
24 TQFN T2444+4
21-0139
90-0222

MAX5184BEEG+

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Digital to Analog Converters - DAC 10-Bit High Speed DAC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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