XRA1206IG16-0A-EB

Exar Corporation 48720 Kato Road, Fremont CA, 94538 (510) 668-7000 FAX (510) 668-7017 www.exar.com
XRA1206
8-BIT I2C/SMBUS GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
SEPTEMBER 2011 REV. 1.0.0
GENERAL DESCRIPTION
The XRA1206 is an 8-bit GPIO expander with an I
2
C/
SMBus interface. After power-up, the XRA1206 has
internal 100K ohm pull-up resistors on each I/O pin
that can be individually enabled.
In addition, the GPIOs on the XRA1206 can
individually be controlled and configured. As outputs,
the GPIOs can be outputs that are high, low or in
three-state mode. The three-state mode feature is
useful for applications where the power is removed
from the remote devices, but they may still be
connected to the GPIO expander.
As inputs, the internal pull-up resistors can be
enabled or disabled and the input polarity can be
inverted. The interrupt can be programmed for
different behaviors. The interrupts can be
programmed to generate an interrupt on the rising
edge, falling edge or on both edges. The interrupt
can be cleared if the input changes back to its original
state or by reading the current state of the inputs.
The XRA1206 is an enhanced version of the
TCA6408. The XRA1206 is pin and software
compatible with the TCA6408.
The XRA1206 is available in 16-pin QFN and 16-pin
TSSOP packages.
FEATURES
1.65V to 3.6V operating voltage
Integrated level shifters
8 General Purpose I/Os (GPIOs)
5V tolerant inputs
Maximum stand-by current of 1uA at +1.8V
I
2
C/SMBus bus interface
I
2
C clock frequency up to 400kHz
Noise filter on SDA and SCL inputs
Up to 4 I
2
C Slave Addresses
Individually programmable inputs
Internal pull-up resistors
Polarity inversion
Individual interrupt enable
Rising edge and/or Falling edge interrupt
Input filter
Individually programmable outputs
Output Level Control
Output Three-State Control
Open-drain active low interrupt output
Active-low reset input
Pin and software compatible with TCA6408
3kV HBM ESD protection per JESD22-A114F
200mA latch-up performance per JESD78B
APPLICATIONS
Personal Digital Assistants (PDA)
Cellular Phones/Data Devices
Battery-Operated Devices
Global Positioning System (GPS)
Bluetooth
XRA1206
2
8-BIT I2C/SMBUS GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS REV. 1.0.0
FIGURE 1. XRA1206 BLOCK DIAGRAM
I
2
C/
SMBus
Interface
A0
SCL
SDA
GPIO
Control
Registers
RESET#
IRQ#
P0
GPIOs
P1
P2
P3
P4
P5
P6
P7
VCC (1.65V – 3.6V)
GND
Integrated
Level
Shifters
(1.65V – 3.6V)
VCCP
ORDERING INFORMATION
PART NUMBER PACKAGE
NUMBER OF
GPIO
S
OPERATING TEMPERATURE
R
ANGE
DEVICE STATUS
XRA1206IL16-F QFN-16 8 -40°C to +85°C Active
XRA1206IL16TR-F QFN-16 8 -40°C to +85°C Active
XRA1206IG16-F TSSOP-16 8 -40°C to +85°C Active
XRA1206IG16TR-F TSSOP-16 8 -40°C to +85°C Active
NOTE: TR = Tape and Reel, F = Green / RoHS
FIGURE 2. PIN OUT ASSIGNMENTS
XRA1206
16-Pin TSSOP
3
5
4
7
6
8
1
2
VCC
A0
RESET#
P0
P1
P2
P3
GND
9
10
11
12
13
14
15
16 VCCP
SDA
SCL
IRQ#
P7
P6
P5
P4
XRA1206
16-Pin QFN
P1
P2
P0
RESET#
GND
P3
P4
P5
VCC
A0
VCCP
SDA
P7
P6
IRQ#
SCL
16 15 14 13
5678
2
1
3
4
11
12
10
9
XRA1206
3
REV. 1.0.0 8-BIT I2C/SMBUS GPIO EXPANDER WITH INTEGRATED LEVEL SHIFTERS
PIN DESCRIPTIONS
Pin Description
NAME
PIN# PIN#
TYPE DESCRIPTION
I
2
C INTERFACE
SDA 13 15 I/O
I
2
C-bus data input/output (open-drain).
SCL 12 14 I
I
2
C-bus serial input clock.
IRQ# 11 13 OD
Interrupt output (open-drain, active LOW).
A0 16 2 I
This pin selects the I
2
C slave address. See Table 1.
RESET# 1 3 I
Reset (active LOW) - A longer than 40 ns LOW pulse on this pin will reset the
internal registers and all GPIOs will be configured as inputs.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
2
3
4
5
7
8
9
10
4
5
6
7
9
10
11
12
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCCP 14 16 Pwr
1.65V to 3.6V VCC supply voltage for GPIOs.
VCC 15 1 Pwr
1.65V to 3.6V VCC supply voltage for I
2
C-bus interface.
GND 6 8 Pwr
Power supply common, ground.
GND Center
Pad
- Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther
-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open
-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-16 TSSOP-16

XRA1206IG16-0A-EB

Mfr. #:
Manufacturer:
MaxLinear
Description:
Interface Development Tools XRA1206IG16-0A-EB
Lifecycle:
New from this manufacturer.
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