IRFZ34S, IRFZ34L, SiHFZ34S, SiHFZ34L
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Vishay Siliconix
S15-1659-Rev. D, 20-Jul-15
7
Document Number: 90368
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Fig. 14 - For N-Channel
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Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?90368
.
Document Number: 91364 www.vishay.com
Revision: 15-Sep-08 1
Package Information
Vishay Siliconix
TO-263AB (HIGH VOLTAGE)
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the
outmost extremes of the plastic body at datum A.
4. Thermal PAD contour optional within dimension E, L1, D1 and E1.
5. Dimension b1 and c1 apply to base metal only.
6. Datum A and B to be determined at datum plane H.
7. Outline conforms to JEDEC outline to TO-263AB.
5
4
1
3
L1
L2
D
B
B
E
H
B
A
Detail A
A
A
c
c2
A
2 x e
2 x b2
2 x b
0.010 A B
MM
± 0.004 B
M
Base
metal
Plating
b1, b3
(b, b2)
c1
(c)
Section B - B and C - C
Scale: none
Lead tip
4
34
(Datum A)
2
C
C
B
B
5
5
View A - A
E1
D1
E
4
4
B
H
Seating plane
Gauge
plane
0° to 8°
Detail “A”
Rotated 90° CW
scale 8:1
L3
A1
L4
L
MILLIMETERS INCHES MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D1 6.86 - 0.270 -
A1 0.00 0.25 0.000 0.010 E 9.65 10.67 0.380 0.420
b 0.51 0.99 0.020 0.039 E1 6.22 - 0.245 -
b1 0.51 0.89 0.020 0.035 e 2.54 BSC 0.100 BSC
b2 1.14 1.78 0.045 0.070 H 14.61 15.88 0.575 0.625
b3 1.14 1.73 0.045 0.068 L 1.78 2.79 0.070 0.110
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.066
c1 0.38 0.58 0.015 0.023 L2 - 1.78 - 0.070
c2 1.14 1.65 0.045 0.065 L3 0.25 BSC 0.010 BSC
D 8.38 9.65 0.330 0.380 L4 4.78 5.28 0.188 0.208
ECN: S-82110-Rev. A, 15-Sep-08
DWG: 5970
Document Number: 91367 www.vishay.com
Revision: 27-Oct-08 1
Package Information
Vishay Siliconix
I
2
PAK (TO-262) (HIGH VOLTAGE)
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm per side. These dimensions are measured at the outmost
extremes of the plastic body.
3. Thermal pad contour optional within dimension E, L1, D1, and E1.
4. Dimension b1 and c1 apply to base metal only.
A
E
B
A
A
A
c2
c
A1
Base
metal
Plating
b1, b3
(b, b2)
c1
c
Section A - A
Section B - B and C - C
Scale: None
E1
E
Seating
plane
Lead tip
(Datum A)
L1
L2
B
B
C
C
L
D
2 x e
3 x b2
3 x b
0.010 A B
M
M
D1
MILLIMETERS INCHES MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX. DIM. MIN. MAX. MIN. MAX.
A 4.06 4.83 0.160 0.190 D 8.38 9.65 0.330 0.380
A1 2.03 3.02 0.080 0.119 D1 6.86 - 0.270 -
b 0.51 0.99 0.020 0.039 E 9.65 10.67 0.380 0.420
b1 0.51 0.89 0.020 0.035 E1 6.22 - 0.245 -
b2 1.14 1.78 0.045 0.070 e 2.54 BSC 0.100 BSC
b3 1.14 1.73 0.045 0.068 L 13.46 14.10 0.530 0.555
c 0.38 0.74 0.015 0.029 L1 - 1.65 - 0.065
c1 0.38 0.58 0.015 0.023 L2 3.56 3.71 0.140 0.146
c2 1.14 1.65 0.045 0.065
ECN: S-82442-Rev. A, 27-Oct-08
DWG: 5977

IRFZ34STRL

Mfr. #:
Manufacturer:
Vishay
Description:
MOSFET N-CH 60V 30A D2PAK
Lifecycle:
New from this manufacturer.
Delivery:
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